Electronics Forum | Thu Sep 25 16:01:25 EDT 2003 | denis
We bought a Ersa rework station (IR technology) recently and we found in trouble when having to replace BGA with metal heat sink cover. I am affraid that we will probably have to invest money again in a convection rework system. Does someone can refe
Electronics Forum | Fri Sep 26 08:15:01 EDT 2003 | Gabriele
Forced gas (hot air or N2 according to solder paste or flux) will be the solution. To rework Ceramic (Aluminum lid Heat Sink)BGA (32 mm square ) or Ceramic Colum Grid Array C-CGA 1,25 and 1,00 mm colum (pitch 42,5mm square), also them capped with a
Electronics Forum | Thu Sep 25 17:19:17 EDT 2003 | bpeay
Greetings Denis, Could you be a little more vague on the type of BGA. Who happens to make this beaty? Is it a TI DSP? B
Electronics Forum | Thu Sep 25 18:31:24 EDT 2003 | davef
Denis: You could be correct about metal reflecting IR. When we use our old IR station, we place pieces of aluminum foil around the component to be removed to protect the near-by components.
Electronics Forum | Thu Sep 25 17:35:28 EDT 2003 | denis
To be precise, the component is a Xilinx Virtex platform FPGA with 1152 balls. We also assemble some DSPs up to 1000 balls with metal cover. At best, we can remove the components but it is almost impossible to find a working solder profile using IR.
Electronics Forum | Tue Feb 01 04:11:58 EST 2000 | emmanuel
I am to assembly a power SO on the top side of a double side board. My designer has implemented a lot of thermal vias in the heat sink pad of this component. The problem is that i need to prevent the solder cream from polluting the bottom side of the
Electronics Forum | Thu Jun 14 01:04:57 EDT 2001 | procon
Ian, It appears to me you are trying to reflow the star wars project. All this talk about thermal absorbtion, heat differential, etc., it' only a reflow profile? If you read back over the suggestions of all other memos, you will find the solution.
Electronics Forum | Tue Jun 12 20:59:14 EDT 2001 | ianchan
Hi mates, actually my whole problem, is whether to : 1) To offset the heat-absorb ability of the Pallet, that artifically lowers my pcba temperature, is it advisable to artifically increase the overall, oven zone temperatures? offset by estimated +
Electronics Forum | Sun Jun 10 21:18:06 EDT 2001 | ianchan
Hi Guys, Thanks for the tips, will try it on next run. Regards, ianchan :)
Electronics Forum | Tue Jun 12 09:30:42 EDT 2001 | Rob Fischer
I assume the material you are using is black. This may sound far fetched but try using a lighter color material. Going from black to gray has given users as much as fifteen degrees F. less in heat loss.
