Electronics Forum | Wed Dec 05 02:01:51 EST 2007 | lococost
We've done some tests on this and got good results. Of course it can be dependant on the paste properties (thinking of slump in particular), and you need to get the heat under the connector which can be more critcal than in a leaded evironement, but
Electronics Forum | Thu Sep 07 03:47:07 EDT 2006 | vicknesh28
I have been getting non wets on fine pitch QFP packages on random leads during reflow process. I noticed that every time there is some flux residue left between the non-wet lead and the solder pad. No residue was not observed on the rest of the good
Electronics Forum | Thu Nov 18 00:13:09 EST 1999 | Thomas
10% slump). I am finding out their test std used but I think those lab test is different from real reflow as the heat transfer rate of reflow oven is much higher. Any one care to share your views?
Electronics Forum | Tue Nov 09 20:16:31 EST 1999 | Thomas
10% slump). I am finding out their test std used but I think those lab test is different from real reflow as the heat transfer rate of reflow oven is much higher. Any one care to share your views?
Electronics Forum | Mon Jan 15 06:18:50 EST 2007 | CL
Good Morning Stephen, 1) Most solder paste manufacturers recommend a 2 hour temperature stabilazation period. Solder paste should not be opened and exposed to ambient air if it is still cold. 2)Manufacturers do not reccomend mixing old and new paste
Electronics Forum | Thu Aug 10 13:16:17 EDT 2000 | Bob Willis
Here is some thing that I wrote a while back on solder beading. First what is a Solder Bead? The term solder bead is used to differentiate it from solder balls. A solder bead is a solder ball but its location is normally constant unlike solder bal
Electronics Forum | Wed Mar 10 09:52:22 EST 1999 | justin medernach
| We are starting up an SMT line with a printer and convection oven.... The area we are considering for the printer is totally uncontrolled for humidity, temperature and even cleanliness. | | We are working on the filters to keep particulates down,
Electronics Forum | Tue Jan 11 07:46:23 EST 2000 | Dave F
Wolfgang: Boy it's tough to convey context in this medium, isn't it? Clipped from our paste storage work instruction, environmental effects on paste are: 1a Avoid excessive heat (over 80� F). It causes flux separation, reducing print quality. 1b
Electronics Forum | Wed Oct 14 13:52:59 EDT 1998 | Bill Schreiber
Dear Sanjay, An important issue involved when stencil printing adhesives vs. solder paste is: How do you clean the stencils after printing? Do you need two machines? Two chemistries? Two waste streams? What are the potential environmental impacts an
Electronics Forum | Mon Aug 22 10:33:23 EDT 2005 | davef
Q1. What is recommended viscosity standard? A1: There is no standard. ASTM D4040-05 "Standard Test Method for Rheological Properties of Paste Printing and Vehicles by the Falling-Rod Viscometer" is a test method that might work. For more, look her
