Electronics Forum | Tue Oct 18 06:04:39 EDT 2005 | Rob
It depends on a number of factors - including as Russ pointed out, complexity (sometimes you need to create very complex profiles if you have large BGAs and other such components, which require at least 7 heated zones), then you have size, required l
Electronics Forum | Tue Oct 18 12:38:19 EDT 2005 | killer1994
Heller, by far the best oven we have had, It has never been down and we've had it over 10 years now. The other two ovens we have are Quad and they are by far the worst piece of garbage ever put out on the market. Broken every other day. We have looke
Electronics Forum | Tue Nov 15 08:41:04 EST 2005 | Joe Wesley
Since I asked the question - here is what we have identified. We are doing what we call a jump score. Routing critical areas with v-score in non-critical areas. We have optimized the v-score depth as much as we can without having separation through h
Electronics Forum | Fri Nov 04 02:23:58 EST 2005 | grantp
Hi, Yes, you will save a lot of money in the end. From what I have experienced you cannot heat up a oven full of air, and cool it down fast enough to match a suitable reflow profile. So passing the board through the zones using an inline oven is th
Electronics Forum | Tue Nov 15 09:31:27 EST 2005 | arclightzero
I have been reading a good deal about IMC (purple plague in particular) in gold wire/aluminum pad wire bonds. My company uses ultrasonic wedge bonding, and for the most part all of our bonding is gold/gold, however we have one particulr part that has
Electronics Forum | Wed Dec 14 07:38:56 EST 2005 | tk380514
the original question was: Please give me some guidelines on designing Stencils for Fine Pitch. which i did however, 40% fallout for solder shorts this could be caused by many other processes having gone wrong before, i.e. type of solder paste
Electronics Forum | Thu Dec 15 17:30:42 EST 2005 | GS
Yes Davef, storage condition and long time remaining on shelf could effect pealing strength, but we experimented that by using Polystirene Carrier Tape also this problem was reduced almost to zero. Df, If I am not wrong when you talk about pr
Electronics Forum | Tue Dec 27 10:57:20 EST 2005 | DannyJ
I'm not sure if I understand the question correctly... Mainly, drill the mushroomed end of the rivet with a drill bit that is slightly larger than the shaft size of the rivet and remove the cover. Then, you should have easy access to what you need t
Electronics Forum | Thu Jan 19 06:25:42 EST 2006 | bwet
There are several life studies (see for example http://www.solder.net/stencilquik/articles.asp) which point to higher reliability of reworked BGAs using solder paste vs flux. The theory on the mechanisms which allow this to happen are as follows: 1
Electronics Forum | Tue Jan 31 14:23:39 EST 2006 | samir
Chunks, For our lead-free eval, we had the same problem with "charred looking" solder paste up the component termination of one of the smaller discretes, coupled with excessive solder balling...this smaller part did see peak temps in the 240 range -
