Electronics Forum | Fri Jan 04 14:21:35 EST 2008 | ck_the_flip
If all your doing is trying to measure oven repeatability, but then you wanna do it a bunch of times, have a profiling "board" constructed out of say... delmat, delrin, or some other glastic-type pallet material. Have the T/C's permanently fastene
Electronics Forum | Sun Apr 07 18:21:08 EDT 2002 | murt
Hi I am a collage student and I was wondering if anyone could explain to me how you would estimate the trough-put, product and cycle time for a double-sided mixed technology pcb assembly. I would be grateful for any information Thanks Martin.
Electronics Forum | Mon Nov 07 10:33:48 EST 2016 | huske
Which process do you have a question about? Is there something more specific you're looking for? Basically you're close on the cycle. And this is a very basic cycle, there are many types of nozzles,machines,methods that will do this slightly differe
Electronics Forum | Wed Nov 16 08:53:26 EST 2005 | nkbkiran
Once the gerber files and BOM list are generated by CAD packages for download on to SMT production line....How is the cycle time of that PCB operation determined? Is their information with in Gerber files by which you can estimate, before actual pr
Electronics Forum | Thu Aug 12 11:00:42 EDT 2010 | hegemon
Without seeing a picture, my first instinct would be first and foremost some fixturing that provides full support for your print process. After that, since you are citing bow and twist, consider that the fixturing might as well travel through the ov
Electronics Forum | Wed Apr 01 04:34:41 EST 1998 | Alan Pestell
We are looking at reflow soldering some Flexi-rigid pcbs. I have heard that IR reflow soldering can make the Polyimide "self heat" and cause de-lamination. Does anyone have any info.
Electronics Forum | Thu Aug 12 10:49:22 EDT 1999 | Ray Hare
I am currently involved with designing a pcb which will use 225 pin bga,s The problem with this design is that the components will dissipate a lot of heat and the design we have come up with is use the middle 6 or 7 rows of balls as the grounding,th
Electronics Forum | Tue Mar 25 13:55:05 EDT 2014 | horchak
Ok lets put it this way. If the PCB house used a high quality mask and properly applied it to a properly cleaned surface and properly cured it, then as Dave stated above there are only two things that can destroy it. Excessive heat and overly aggress
Electronics Forum | Wed Mar 19 08:38:13 EDT 2014 | davef
I can't picture much of what you're saying, not for nothing, I'm just not connecting. During assembly, solder mask can affected by heat and chemicals. Typically this would be during: * Soldering * Cleaning I will tell you this: Not to defend assem
Electronics Forum | Tue Aug 28 08:28:30 EDT 2012 | rgduval
We agree with all of the previous comments, and would add the following: Warpage is generally caused by excess moisture in the raw boards. Have you tried baking the boards prior to assembly? We had this issue on a simple 4-layer board, and found t
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