Electronics Forum | Fri Jun 06 18:44:26 EDT 2003 | davef
No, no. It's koscher to have thermal planes. You just need to: * Work with your fabricator to keep the layup balanced. * Relieve the plane so that it doesn't cause assembly problems. While probably not directly for your part, it gives a starting p
Electronics Forum | Thu Jun 05 00:00:09 EDT 2003 | Jacky
Hi, Can anyone tell me where I can get heatsinks for DPAK devices? It will be used for cooling IGBTs. Preferably, the heatsink device should be soldered for easy production. Thanks alot.
Electronics Forum | Thu Jun 05 15:34:16 EDT 2003 | davef
Heatsink DPAK SMT Tin Plated: Wakefield Part Number: 21736CT We have no relationship nor receive benefit from the company referenced above. Look here: http://www.heatsink-guide.com/links.htm
Electronics Forum | Mon May 24 04:05:04 EDT 1999 | Charles Stringer
Can anyone steer me towards a supplier of heatsinks suitable for use on a PQFP 160. Before you shoot me down in flames, I know that I am not going to get much heat away from the die because of the plastic but the application is such that the board te
Electronics Forum | Wed Sep 15 22:01:34 EDT 2004 | rohman23
We've had a few problems with printing a flex-rigid PWB, and I'm hoping some of you could throw some opinions/suggestions my way. Our PWB is about 8" x 11" divided into two parts (side A & B) by 2 wide flex cables. Each of these flex cables is ab
Electronics Forum | Mon May 24 10:17:54 EDT 1999 | john thorup
| Can anyone steer me towards a supplier of heatsinks suitable for use on a PQFP 160. Before you shoot me down in flames, I know that I am not going to get much heat away from the die because of the plastic but the application is such that the board
Electronics Forum | Wed Mar 15 04:36:16 EDT 2017 | Rob
@ Sr.Tech, Any voiding means that the part of the package under the void is not forming a solid thermal interface with the PCB, therefore it's heatsinking capability is reduced. With the drive for smaller packages with higher power handling capabil
Electronics Forum | Wed Mar 15 09:53:58 EDT 2017 | rob
Hi Etimov, Understood that to us assembling parts that IPC is king, however it isn't neccesarily the bible for design engineers. We've had customers demand almost zero voiding, or had to use conductive epoxy to avoid it. For some of us solder joi
Electronics Forum | Thu Mar 16 03:45:51 EDT 2017 | rob
It's the same thermal issue whether it's a die or package. It's different if it is just a signal trace, but if it's a heatsink pad (LED, FET, Motor driver, PSU IC etc). I think the voiding issue boils down to what the part is actually doing. The or
Electronics Forum | Tue May 01 20:40:38 EDT 2018 | sarason
In the past I have worked on 600 Amp FET Blocks. The rule was no voids. The circuit board would be heavy copper. 4 times normal plating time. Not particularly high resolution on the board say 20 mils. To help with the heavy plating. The boards were t
