Electronics Forum | Sat May 19 02:54:20 EDT 2001 | S.FitzPatrick
T.W.I.M.C. I am trying to located a copy, or at least the proper number, for the ISO standards on soldering, rework, and PCB wiring. I am about to start up a SMT solder rework class at work. I recall that when I worked for Solectron
Electronics Forum | Thu May 31 21:53:41 EDT 2001 | davef
When the "novel" conversations predominate and the sometimes incessant "help I got solder balls" threads fade, yes. [The 'incessant solder ball' problem is one of the reasons that people (like his Slappiness) are encouraged to check the Archives (th
Electronics Forum | Thu Jun 07 15:37:32 EDT 2001 | Claude_Couture
Kerryn, It's the first time I hear someone who needs an automated inspection machine to check the cleanliness of stencils. Why not improve on the cleaning method itself. I use ultrasonic batch cleaner. It takes 3 minutes to clean a stencil, 2 minutes
Electronics Forum | Sun Jun 10 20:47:25 EDT 2001 | erichua
Our company is going to start building PCB with flipchip and CSP component. I'm now trying to get more information on the flipchip and CSP process. Because I'm still new to both (flipchip & CSP) and could like to have more information. Can anyone tel
Electronics Forum | Thu Jun 14 21:06:49 EDT 2001 | davef
We rate each board for producibility. [Our rating chart may be based on some things that Bob Willis did. Check his site [http://www.bobwillis.co.uk/ ] for all kinds of neat stuff. Maybe even bring him in to help you sort through things.] There
Electronics Forum | Wed Jun 13 16:20:33 EDT 2001 | Gregory Stanton
Does anyone know of a quick method for developing reflow profiles for a Conceptronics HVA 102 reflow oven? Our plant is exceptionally busy and it's difficult to get access to the machine. I've been told by a few folks the oven has enough zones (7)
Electronics Forum | Wed Jun 13 16:58:26 EDT 2001 | Ken Lester
Greg; The universal profile concept maybe misleading. the main objective of a reflow system is to reach a certain temperature and maintain it for the required period of time. If your initial profile is set to accomodate this on any board the only va
Electronics Forum | Fri Jun 15 09:16:46 EDT 2001 | adam
Thanks Dave. About your second comment, the issue is placing BGA connectors mirror image (male, and female), the connector sometimes shifts during placement before reflow. we are using a six mil stencil for both sides with minimum paste deposit. a
Electronics Forum | Mon Jun 18 21:21:25 EDT 2001 | davef
Two things: 1 A flat surface will probably help the "balls on the socket sliding off the ridge of HASL" problem, but possibly consider less risky choices for your flat surfaces that immersion silver, like: OSP, ENIG, and immersion tin. 2 Don�t throw-
Electronics Forum | Fri Jun 22 13:13:54 EDT 2001 | dougt
I worked as a tech for a company that produced momagraphy equipment about 5 years ago. Every so often we had a problem with a board that was suspected to be the board material itself and used the mamography equipment to check this. In some cases it
