Electronics Forum | Tue Feb 01 09:53:58 EST 2000 | Ron Costa
I've been using the Electroless Nickel/Immersion Gold plating process for some time now. Here is what i know: It's very flat and solderable if you hold the board house to the following criteria: 120u inches of Nickel 4-9u inches of Gold What type of
Electronics Forum | Mon Jan 31 15:24:02 EST 2000 | Jason Bentley
from what I know the moisture does play a foctor in the ESD but if you are looking for wether or not it will provide more ESD I dont think so. If you keep your operators grounded with 2 Foot straps thats all the grounding that you need unless you are
Electronics Forum | Fri Jan 21 10:40:15 EST 2000 | Dave Chapman
Having adjusted the profile speed slower and adjusting the temps to the recommended lower levels, amazingly the mid chips have almost disapeared (90%). It appears they have been trying to run a "1 profile fits all" on the ovens for Alpha 737 and UP78
Electronics Forum | Wed Jan 12 18:00:12 EST 2000 | David J Nowak
We have a quad flatpack that is adhesively bonded to the face of the printed wiring board. We need to remove it from the board. The leads have been unsoldiered. We are thinking of placing a rectangular cavity on the end of a shaft over the QFP and
Electronics Forum | Wed Jan 12 13:19:20 EST 2000 | Wolfgang Busko
Hi Abbas, Dave gave you a lot of sources which cover I think almost all topics in this field. Like in a search function if you are interested in specific topics could you please specify what you are interested in so that ones knows what answer could
Electronics Forum | Thu Jan 06 01:55:01 EST 2000 | Roni Haviv
From my experience: It's depends on your messurment tools and the component: - Average high (at least 3 messurment points) should be 6 mils max. (you'll always get pick points of 4-7 mils!). - It depends on component tech./pitch: in pitches great
Electronics Forum | Thu Dec 30 23:25:49 EST 1999 | Henry C. Yao
We're using 96.5/3.5 high temp solder paste for our production and we're encountering soldering defects particularly non wetting (tombstoning). A technical document I read mentioned that there is a sort of a problem with the wettability of this paste
Electronics Forum | Fri Dec 31 20:04:10 EST 1999 | Stu Leech
At Altos Engineering we do a lot of process testing of our TVP drying systems for demoisturizing. We store test devices in metalized vapor-proof bags. Instead of heat sealing, we use Croc-Clamps to seal the bags. They have been tested for sealing eff
Electronics Forum | Mon Dec 27 12:24:47 EST 1999 | RICK_EEI
Hi everyone. We use a small ultrasonic aqueous cleaner. After each PCB we hand solder, (water soluble) we place it in the cleaner immediately. Lately we have had some problems with the solder joints appearing to be corroding away. We tried lowering t
Electronics Forum | Tue Dec 28 12:26:22 EST 1999 | Christopher Lampron
Rick, Does the ultrasonic cleaning system that you use reuse the same water for each cleaning cycle? I have had a similar problem in the past using a Brandson ultrasonic cleaner and water soluable flux. The problem was the buildup of flux in the clea
