Electronics Forum | Tue May 11 10:58:51 EDT 2010 | davef
Paste for dispensing differs significantly from paste for printing. [B Toleno Henkel Loctite]. So, if you compare paste characteristics: Characteristic of paste||Printable ||Dispensable Viscosity [million centipoise]||0.8 to 1||0.2 to 0.4 Metal cont
Electronics Forum | Wed Nov 07 21:36:17 EST 2012 | davef
Multiple process and rework thermal cycles are brutal on boards and components. Improving reliability of products through reducing thermal stress ends-up being a major driver to the interest in lower MP LF solders. Binary LF solders require the addit
Electronics Forum | Fri Feb 09 12:31:35 EST 2007 | realchunks
Ask Brain Toleno at "circuitsassembly.com/blog" He's a smart guy and works as team lead at Henkel Loctite. Just don't take him out for drinks.
Electronics Forum | Thu Jun 04 14:27:36 EDT 2015 | cyber_wolf
Has anyone tried this paste ? Sounds interesting... http://www.henkel-adhesives.com/loctite-g10-solder-47933.htm
Electronics Forum | Wed Jan 03 14:10:33 EST 2001 | Hussman
I've been told that they will be getting out of bar solder. Maybe they plan to introduce a new soldr under the Henkel name or something. Otherwise, I've been told the paste buisness is just fine.
Electronics Forum | Thu Apr 10 07:47:47 EDT 2008 | ck_the_flip
Stencil design and pad layout are key. Too far apart - bad. If your pad geometry is correct, try the inverted home plate. That has worked well for me in the past. That, coupled with a 5-mil stencil. With regard to solder paste, some manufacturer
Electronics Forum | Sun Jul 26 05:56:28 EDT 2015 | spoiltforchoice
http://www.surfacemountprocess.com/solder-paste-printing-process.html this site has some pretty good general advice for the novice. I am in no way affiliated with it and I have no idea as to its eventual commerical aims (if any). ENIG if your produc
Electronics Forum | Tue Jan 13 12:06:23 EST 2004 | blnorman
Can't tell you based on sales, but here's a list I know of: Kester Alpha Metals Aim Indium Multicore (Henkel/Loctite) Qualitek
Electronics Forum | Wed Nov 01 07:32:33 EST 2006 | davef
What you have run up against is the unfortunate consequence of the transition period from Sn-Pb to Pb-free. In the past 2-3 years there have been several studies highlighting the differences in reliability between mixed metal systems, Sn/Pb, and SAC
Electronics Forum | Thu May 01 10:51:09 EDT 2008 | realchunks
You need a paste designed specifically for this. They are available. Most have 2% silver in them and higher temp flux so you can reflow at "no-lead" temps. The silver aids in the intermaetalic bond and the high temp flux allows you to reflow the n
