Electronics Forum | Tue Jan 25 09:15:02 EST 2005 | Marc A
Good info, thanks for passing along. The company I work for (equipment supplier) ran some tests with lead free material in air and N2 environements for reflow. In the air reflow environement it was noticed that the material does not spread, much li
Electronics Forum | Tue Mar 12 22:27:50 EST 2002 | davef
I'd speculate that the properties of a well formed solder connection processed in air and N2 are indistinguishable. Then again, the pitch is that N2 gives a wider process window, especially for NC flux-types. In the SMTnet Library look for: �Opti
Electronics Forum | Thu Feb 13 03:49:15 EST 2014 | jlawson
Yes all above is correct, as solder deposits get smaller and mesh T4+ , actual metal to air contact surface area increases , say in contrast to T3, add to this less flux , and flux running away from the joint, re-oxidation and what flux is left, can
Electronics Forum | Tue Apr 07 21:56:32 EDT 2009 | davef
electrovert bravo 4050 to find things like: Cookson Electronics News, ISSUE #6 � SUMMER 2002, High Temperature Bravo� 4050 Reflow Oven Available: ELECTROVERT� has introduced a new high temperature reflow soldering system designed for producing lead
Electronics Forum | Thu Oct 04 00:00:58 EDT 2018 | gaintstar
Flason SMT Reflow Ovens: http://www.flason-smt.com/product/China-Reflow-oven.html http://www.flason-smt.com/product/China-Samsung-EXCEN-PRO-High-Speed-SMT-Modular-Chip-Mounter-agent.html http://www.flason-smt.com/product/China-Samsung-SM321-High-Spe
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