Electronics Forum | Fri Feb 03 17:47:06 EST 2006 | Brian Smith
Kester offers Tin-Copper AND Tin-Copper-Nickel. The Kester K100 alloy is a Tin-Copper-Nickel material that is very similar to SN100C. Straight Tin-Copper isn't tremendously popular but can be used in low-cost, consumer-electronics applications wher
Electronics Forum | Sun Oct 20 19:42:29 EDT 2002 | sjpence
Like Russ, I am also curious about the 100% fill requirement. On any thick, high mass board the key is getting as much heat as possible into the board. If you get the board to the proper temperature, solder will flow just about anywhere. As an alte
Electronics Forum | Thu Sep 30 03:37:26 EDT 1999 | Brian
| We are all faced with increasing interconnect density in all we do. This means smaller everything, especially components and that which they are mounted upon but, hopefully, without smaller minds and thoughts. It all demands more process control an
Electronics Forum | Fri Oct 01 00:18:18 EDT 1999 | Earl Moon
| | We are all faced with increasing interconnect density in all we do. This means smaller everything, especially components and that which they are mounted upon but, hopefully, without smaller minds and thoughts. It all demands more process control
Electronics Forum | Fri Oct 01 09:03:25 EDT 1999 | Dave F
| | | We are all faced with increasing interconnect density in all we do. This means smaller everything, especially components and that which they are mounted upon but, hopefully, without smaller minds and thoughts. It all demands more process contro
Electronics Forum | Wed Nov 02 01:30:12 EST 2005 | fctassembly
Hello Arnold, Yes, by definition of joint formation, copper will dissolve in lead free solder in order to form the connecting intermetallic layer. There is a distinct difference in the copper dissolution rates of the major alloys being considered wi
Electronics Forum | Fri May 16 05:17:13 EDT 2014 | julianf
Interesting. How did you connect the gauges in the press? Our press only has connections for thermocouples. But in essence, it's only a wire and an electical output. If you placed these prefabricated gauges on top and on the bottom surface, weren't
Electronics Forum | Thu Nov 03 08:18:17 EST 2005 | fctassembly
Hello Arnold, Just to clarify the Sn100C discussion: Please note that SN100C is the Nihon Superior alloy composed of tin/.7copper/nickel. The key point in regard to SN100C is that Cu does not go directly into solution but first reacts to form an inte
Electronics Forum | Sat May 17 10:38:49 EDT 2014 | sarason
I hate to say this but in all probability this wont work. I have built real strain gages and they depend on the change(Co-effiecent) of resistence with strain(or Stretch). since you are connecting you elements up with copper wire it will frm part of
Electronics Forum | Wed Aug 15 16:04:23 EDT 2001 | davef
First, responding to your question � Several things on copper dissolution in solder are: * A 50um copper wire will dissolve in 60Sn / 40Pb solder at: - 200�C solder in 55 seconds; - 250�C solder in 20 seconds; - 300�C solder in 5 seconds; - 350�C so
