Electronics Forum | Fri Jun 16 10:38:33 EDT 2000 | Iain
I have 15 very large backplanes (.156" thick Au plating) that the ground pins of a high density thru-hole connector were not thermal relieved in the artwork. As a result we are unable to solder the 8 pins that connect to the ground plane. We know t
Electronics Forum | Mon Jun 19 19:08:21 EDT 2000 | Brian W.
IPC-610 Rev B: Paragraph 4.1 (page 52), As an exception to fil requirements on Table 4-1 on thermal heat sink planes plated through holes, a 50% vertical fill of solder is permitted, but with solder extending 360 degrees around the lead with 100% wet
Electronics Forum | Fri Dec 27 01:30:13 EST 2002 | haran
Currently we are running a BGA with a big thermal pad in the middle of the package and encountered high defect of solder shorts.I would like to check whether anyone has experience this problem and how this can be rectified?.
Electronics Forum | Fri Oct 11 09:28:14 EDT 2002 | davef
Designers love to do BIG copper pours for several reasons: * Maximize heat spreading. * Increase EMI shielding. * Laziness. The poor folk that solder the parts on boards HATE big copper planes near solder pads. During soldering, fat copper traces [
Electronics Forum | Thu Jun 02 11:16:23 EDT 2005 | JH
I concern about the Through Hole soldering as well. Currently, we have encountered some problems of Multilayer from Through Hole soldering. The root-cause is probably related to PCB Finish, machine setting, Thermal relief Pad or hole and something e
Electronics Forum | Tue Jul 25 07:37:21 EDT 2017 | stephendo
There are lots of examples of changing a parameter in one direction to fix one issue causes a different problem. Once I asked a layout engineer to adjust thermal relief for through hole parts. First he said ok but a day later he said that he couldn't
Electronics Forum | Thu Feb 03 13:23:30 EST 2005 | caldon
Hi Steve- We have a Glenbrook system and are pretty pleased with it....as far a value vs. cost it works great. I did have an issue with a Soic with a ground plane in the center...yes SOIC!!! The Ground plane was a heat sync that had vias for thermal
Electronics Forum | Fri Dec 27 01:26:08 EST 2002 | haran
Currently we are running a BGA with a big thermal pad in the middle of the package and encountered high defect of solder shorts.I would like to check whether anyone has experience this problem and how this can be rectified?.
Electronics Forum | Thu Jul 13 22:20:38 EDT 2000 | Dave F
=10 mils larger than lead 3 silk screen legend text weight >=10 mils 4 pads >=15 mils larger than finished hole sizes 5 place through hole components on 50 mil grid 6 no silk screen legend text over vias (if vias not solder masked) or holes 7 so
Electronics Forum | Fri Sep 11 09:45:39 EDT 1998 | Earl Moon
| I'm very familiar with the great board space savings of BGA and all the "claims to fame." However, can someone out there tell me if any concern exist in the inspection realm. Additionally, solder cracking, CTE/TCE mismatches, no leads for stress re
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