Electronics Forum | Tue Oct 22 09:20:31 EDT 2013 | swag
Yes, car rims (and brass tubas)! You finally helped me get to the bottom of this expensive issue. We fired the culprit. It's the same guy that was using the ultrasonic stencil washer to clean car parts on night shift. It might be snake oil, I don
Electronics Forum | Fri Jan 08 16:48:13 EST 1999 | Earl Moon
| Our company is beginning to delve into some 20 mil applications and I'm curious to hear what kind of success others have had placing these components. What kind of fall out rates we might expect or any specific difficulties encountered and what ac
Electronics Forum | Tue Jan 12 00:33:30 EST 1999 | Jason
| | Our company is beginning to delve into some 20 mil applications and I'm curious to hear what kind of success others have had placing these components. What kind of fall out rates we might expect or any specific difficulties encountered and what
Electronics Forum | Tue Dec 12 17:54:04 EST 2000 | ralph
I've had this problem myself, though in using water soluables. But the process to eliminate it is still the same. There are three possible causes for this to occure. Too much humidity, to much solder, and too much heat. Are you leaving the paste
Electronics Forum | Wed Apr 11 11:02:53 EDT 2001 | dave
Hi I found it's hard to attach thermocouple on profile board at fine pitch component by high temp solder. Does any one know the good way to do it? Thanks in advance. Dave
Electronics Forum | Wed Apr 11 11:40:44 EDT 2001 | gcs
High temp solder is the best, but your profiler manufacturer will have some type of adhesive. I know KIC does.
Electronics Forum | Wed Apr 11 14:05:30 EDT 2001 | davef
No, there's not a really great epoxy product for attaching thermocouples in reflow. Specifically, what's your problem? From Sanders Temprobe verbage ... Adhesives There are two general classes of material commonly used to adhesive bond thermoc
Electronics Forum | Sat Oct 07 04:02:50 EDT 2000 | C.J. Long
Good morning, All: I am from PCB shop and one of our customer is experiencing solder bridge on 16 mil pitch QFP( immersion gold finish). Land width requirement is 8 +/- 1 mil measured over top of of land and our mean is 7 mil. Bottom land width is 8
Electronics Forum | Thu Jul 17 11:36:41 EDT 2003 | caldon
My AOI wish list would include features that: 1)Character recognition, 2) Correct Placement (including missing), 3) Solder joint inspection (solder present), 4) Shorts, 5)Polarity check, 6)Coplanarity, 7)gerber/or Cad compatible (no gold boards), 8)e
Electronics Forum | Thu Sep 19 11:14:45 EDT 2002 | Jim M.
We had lots of problems with bridging on 15.8mm pitch, QFP17-160 at the start.The board was .032 thick, double sided-six boards to a panel. Here is the problems (not neccessarily in the biggest to little but as i remember them) and solutions that he
