Electronics Forum: high tem double side tape (Page 1 of 2)

High-temperature thermal profiling adhesive

Electronics Forum | Fri Jan 09 23:53:48 EST 2004 | Dean

How high are we talking? 1000 Celsius? KIC Thermal Profiling double sided aluminum profiling tape. I have used at an extreme application of 240 to 300 degrees celsius for 18 minutes. With up to 30 passes with no visible degree of deterioration.

Flex board pallet

Electronics Forum | Thu Jul 27 12:30:37 EDT 2006 | Rob

Hi David, we used the following techniques in high volume production, depending on the type of flexi-board: (all were in milled pockets in a durastone pallet) 1) Kapton tape top & bottom 2) Spray mount & samll amount of kapton tape (you only had

Accuracy

Electronics Forum | Fri Aug 26 23:00:18 EDT 2011 | mac5

On any new project we use double sided tape and place all the components to check for placement accuracy and polarity prior to pasting a board. We salvage any large/high dollar parts and toss the passives.

How to install FBGA ICs on both sides of Flex boards with no stiffeners ?

Electronics Forum | Thu Aug 09 14:00:51 EDT 2018 | tey422

To me the most challenge would be the printing step. If you can print it, you should able to run it with SMT. We ran similar thickness flex boards before. But it's long flex with small stiffener at both ends, and it was 10up array. You need fixture

Re: 15G PQFP

Electronics Forum | Tue Jun 02 08:30:30 EDT 1998 | Jon Medernach

I have to agree with Steve. If the problem is progessively worse the problem is the pitch conversion that was used, and I have seen it before. It may be masked by the solder paste which could be on pitch but after reflow the paste wickes to the pad

First Article Inspection

Electronics Forum | Wed May 15 22:23:38 EDT 2002 | ianchan

Hi mates, need some help to resolve a thumb-twine situation. As a high-mix, low volume prototype build house, we always conduct a first article inspection (FAI) on every model setup conversion in the SMT production Lot run. we do this FAI by mounti

Re: Adhesion loss on passives over wave

Electronics Forum | Mon Mar 22 18:03:15 EST 1999 | Marc

| | | | | Hi folks, | | | | | | | | | | I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diamet

MyData Missing Placements

Electronics Forum | Tue Jul 10 11:36:22 EDT 2007 | dyoungquist

Hi SMT Frog We are using an upgraded Mydata TP9-1 system to place 0402s. We do an electrical test plus mechanical centering and use the C14 tool. A few things we have observed/learned: 1) Is the machine not picking the part up out of the tape? Po

Re: Board Warp And Twist

Electronics Forum | Thu Aug 10 13:12:10 EDT 2000 | Bob Willis

You may care to review the following from my Circuits Assembly page on line. "HOW FLAT IS FLAT AND DO WE NEED FLAT CIRCUIT BOARD, YES WE DO ? As production problems go there is one that keeps reoccurring time and time again. The blame is usually di

Foam fluxer maintenance, storage and cleaning

Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef

Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept

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