Electronics Forum | Thu Mar 01 19:38:12 EST 2007 | Wayne
1) run the BGA side first. set the bottom temp lower (if your reflow oven have top and bottom temp setting) for connector side while doing your 2nd reflow. 2) run the BGA side first with your normal leadfree paste, and run the connector side with low
Electronics Forum | Fri Mar 02 14:43:28 EST 2007 | stimpk
Are you using lead free paste also? Are all the other parts on side 1 ROHOS ? etc.. can they handle your leadfree profile. Those need answered 1st. But to answer your question. Yes you can run the BGA side 1st ( hopefully with leadfree paste and ho
Electronics Forum | Fri Dec 22 12:17:02 EST 2000 | vickij
Hi! Has anyone out there ever tried to use a high-temp and a low-temp solder paste on a double-sided board without using an adhesive? (Populate the bottom side with the high temp paste, reflow, turn it over, then run the top side). I looked in the
Electronics Forum | Thu Nov 18 08:43:30 EST 1999 | Will Buehler
We currently stuff parts on one side and use a reflow oven. We have been told that many companies are stuffing both sides without high-temp solder or glue. I understand that glue is usually only needed for wave soldering processes. Is it true that
Electronics Forum | Tue Dec 26 11:09:16 EST 2000 | acahill
High temp paste or not, I feel it's all up to the oven,and/or the stencil design. are there sufficient solder joints, before running the opposite side (are the apertures large enough to achieve a hardy fillet or to small, allowing enough paste to vis
Electronics Forum | Tue Jan 02 14:50:37 EST 2001 | fmonette
Dear Vicki, If you decide to use high temp paste, I suggest that you verify the rating of the components, especially for moisture-sensitive devices which are normally qualified at peak reflow temperatures of 220-235C. The specified floor life will
Electronics Forum | Wed Jun 03 13:50:32 EDT 1998 | Chrys
| Can anyone tell me if there is a reference for smt component height specs on the bottom side of a board, which will also go through wave soldering. A current design I am reviewing has tant caps(7343) and a crystal on the back side. Should I only b
Electronics Forum | Wed Mar 04 07:08:55 EST 1998 | Pat Copeland
I am looking for information on reflow temps for a flex board. There is only one 6 pin IC but the board has a 3M double sided tape. Is it possible to reflow without damaging the tape. Any suggestions?
Electronics Forum | Fri Jan 09 23:53:48 EST 2004 | Dean
How high are we talking? 1000 Celsius? KIC Thermal Profiling double sided aluminum profiling tape. I have used at an extreme application of 240 to 300 degrees celsius for 18 minutes. With up to 30 passes with no visible degree of deterioration.
Electronics Forum | Thu Jul 27 12:30:37 EDT 2006 | Rob
Hi David, we used the following techniques in high volume production, depending on the type of flexi-board: (all were in milled pockets in a durastone pallet) 1) Kapton tape top & bottom 2) Spray mount & samll amount of kapton tape (you only had
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