Electronics Forum | Wed Sep 03 07:39:19 EDT 2008 | pjc
You may not be getting enough exhaust pull, so the cooling modules over temp. Try swapping blower motors to isolate that before buying one. STANDARD AIR OPERATION: - Load-end: 150 cfm (255 m3/hr) at the 4� (102 mm) stack (minimum requirement) - Unlo
Electronics Forum | Mon Sep 01 04:55:20 EDT 2008 | benefon
Hello all Our Omni 5 has given the 'Cooling module high temp' warning twice during the past month. I suspect that the blower motor is the culprit but have not been able to verify this because the oven has started up normally after acknowledging the
Electronics Forum | Thu Jan 11 22:01:09 EST 2007 | davef
Joe: I know this is not the correct forum to post chip "reworking" questions. Reply: Rework questions are as appropriate as the next topic here on SMTnet J: BGA will not reflow at any normal temperature level. I believe these chips may have been gen
Electronics Forum | Wed Feb 18 22:18:26 EST 2009 | davef
"acrylic adhesive" "high temperature" tape
Electronics Forum | Fri Jul 25 15:54:22 EDT 2008 | pcbbuilders
I am trying to optimize my reflow profile. i have a 5 zone oven. lead-free: for the 1st 3 zones, i am good, at about 150-200 deg for 150 seconds. during the 4th zone, i am at a temp of 200-220 for 50 seconds. during the 5th zone, i am at 220-245 f
Electronics Forum | Tue Feb 17 15:24:17 EST 2009 | glynnhamer
I know this is going to sound rather sad, but we have been using a Capton tape for years that contains silicone to mask large components as they go over the wave, as well as large plated holes on the pcb. It was handed down for years as accepted prac
Electronics Forum | Tue Dec 12 03:15:13 EST 2000 | Chris May
The profile that you should be using, hopefully, is detailed in the paste data sheet. Connect your thermocouples to various parts of the board, depending on layout, population etc; and then run some trials observing the profile on your oven monitor/
Electronics Forum | Mon Dec 11 15:50:01 EST 2000 | externet
Hi ! Try fresh DRY solder paste... Keep solder paste in a sealed container until the moment of use. Humidity absorbed by the soldering paste becomes vapor violently at the moment of heating it , expelling the solder in form of balls everywhere.
Electronics Forum | Tue Dec 12 17:54:04 EST 2000 | ralph
I've had this problem myself, though in using water soluables. But the process to eliminate it is still the same. There are three possible causes for this to occure. Too much humidity, to much solder, and too much heat. Are you leaving the paste
Electronics Forum | Wed Dec 13 19:40:38 EST 2000 | Jerry Wetzel, SME, EM/SME
Your profile must be precise, your stencil aperture sizes and shapes are very important, and the size of the pads on the boards should be very close to what the part manufacturer recommends. We had some trouble with hi-temp paste, and discovered tha
