Electronics Forum | Thu Sep 26 14:45:36 EDT 2019 | dwl
Excellent X-ray picture, very helpful! It looks like you have a lot of voiding on the center thermal pad. My guess is that outgassing is pushing solder off the pad which is forming solder balls outside the body of the component package. The first
Electronics Forum | Mon Sep 01 04:55:20 EDT 2008 | benefon
Hello all Our Omni 5 has given the 'Cooling module high temp' warning twice during the past month. I suspect that the blower motor is the culprit but have not been able to verify this because the oven has started up normally after acknowledging the
Electronics Forum | Thu Sep 30 03:37:26 EDT 1999 | Brian
| We are all faced with increasing interconnect density in all we do. This means smaller everything, especially components and that which they are mounted upon but, hopefully, without smaller minds and thoughts. It all demands more process control an
Electronics Forum | Fri Oct 01 00:18:18 EDT 1999 | Earl Moon
| | We are all faced with increasing interconnect density in all we do. This means smaller everything, especially components and that which they are mounted upon but, hopefully, without smaller minds and thoughts. It all demands more process control
Electronics Forum | Fri Oct 01 09:03:25 EDT 1999 | Dave F
| | | We are all faced with increasing interconnect density in all we do. This means smaller everything, especially components and that which they are mounted upon but, hopefully, without smaller minds and thoughts. It all demands more process contro
Electronics Forum | Fri Jul 02 17:05:26 EDT 2004 | blnorman
Depends on your specific application. Can you handle lower reflow temps? Can your parts handle higher reflow temps? What environment will your assembled product have to endure? Lot of different factors come in to play when choosing the right allo
Electronics Forum | Thu Feb 17 21:42:12 EST 2000 | Dave F
Hey Bud: Moved from that Bi-crap to something serious, eh? Several things: 1 Get in touch with Doug Romm (drom@msg.ti.com) at Texas Instruments. He talks palladium. 2 Review the archives on Palladium. 3 I think you're running light on temps. Eut
Electronics Forum | Thu Feb 17 21:42:12 EST 2000 | Dave F
Hey Bud: Moved from that Bi-crap to something serious, eh? Several things: 1 Get in touch with Doug Romm (drom@msg.ti.com) at Texas Instruments. He talks palladium. 2 Review the archives on Palladium. 3 I think you're running light on temps. Eut
Electronics Forum | Wed Oct 04 16:14:17 EDT 2006 | inds
what is your peak temp.. if you try to go too high say 225-230 deg C there is a fair chance of seeing voids.. depending on your ball size and paste volume you can get a good collapse at temps below 225deg C...
Electronics Forum | Tue Feb 10 17:38:22 EST 2015 | mbartel
low volume high mix, looking for advice on what i should get, a stencil machine or a jet printer for smt solder paste. used/new and companies i should look into?
