Electronics Forum | Fri Feb 28 11:02:06 EST 2020 | slthomas
I'm not 100% sure which type of gold you're asking about, but if you're talking about hard gold plating, I think the most common use is to provide a durable surface for things like membrane switch contacts because it resists abrasion and other mechan
Electronics Forum | Mon Dec 18 14:49:23 EST 2000 | Charles Harper
Probably the most important recent event has been the acquisition of International Flexible Technologies by Scheldahl,whose strength in flexible materials will have a major growth impact for flexible circuits--already growing nicely.Also,continuing a
Electronics Forum | Fri Jan 18 18:19:38 EST 2008 | arun2382
Is normal DI rinse cycle enough to wash away all residue after SMT assembly of high density substrate? This substrate would later be over molded to form MCM module package and I am seeing delamination in high density areas of the substrate at MSL3
Electronics Forum | Mon Jul 22 18:00:49 EDT 2002 | davef
It doesn't appear to be a proprietary mix. Maybe it's 'neither Alpha Metals nor Kester WILL [want to] supply it.' It's interesting. A lot of the discussion of a solder replacement for 63/37 has centered on high temperature alloys. In real life,
Electronics Forum | Sat Feb 18 09:20:09 EST 2012 | davef
The 3-Tier PCB library concept was originally created by IEC (International Electromechanical Commission) in 1999 and introduced to IPC in 2000. The concept had to be created as a solution for high density packaging for hand held devices to ruggedize
Electronics Forum | Thu Oct 14 14:11:33 EDT 2021 | SMTA-64387257
Hi All, We are currently looking to add an Xray inspection system into our process. We build high density assemblies with ultra fine pitch BGAs, 0201's, QFN's and every package type one can think of. We would like to use the inspection system to v
Electronics Forum | Mon Aug 02 18:46:33 EDT 1999 | Jim Blankenhorn
| | Has anyone done the research on BGA pad size? suppose I have a 0.030" diameter pad as recommended pad size from the spec, what will the minimum pad size allowed? We are laying out a high density board. | | If you know what component your'e going
Electronics Forum | Fri Apr 09 01:41:35 EDT 2004 | Mike Konrad
Although water soluble (OA) flux is technically the easiest flux to remove, it is also the most damaging type of flux if not removed. A dishwasher lacks the pressure and nozzle design to produce the very small water particle size required for thorou
Electronics Forum | Wed May 24 17:49:51 EDT 2000 | Keith Luke
SMTneters, The end of May finds several recent publications from leading publishers on my desk. I am all too happy to share these books with our loyal SMTneters in the hopes that they will provide us with a timely review of the new release. For ma
Electronics Forum | Tue Jan 16 20:34:17 EST 2007 | davef
DAVE�S BOOKSHELF ASSEMBLER�S ESSENTIALS Title: Soldering in ElectronicsAuthor: RJ Klein WassinkPublisher: Electrochemical PublicationsISBN: 090115024XPublication date: December 1989 I know, I know. The book was written in 1989!!!! I use this b
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