Electronics Forum | Fri Sep 22 07:02:12 EDT 2006 | basem
Thanks Rob. Our concern is placing tiny components side by side at a minimum pitch, along with fairly large BGAs and TSOP2, which are themselves, having small to fine pitch leads. yes, accuracy in placement in our application is crucial, yet, what i
Electronics Forum | Fri Mar 16 12:14:11 EST 2001 | onset
ED, We have grown quite a bit in the past few years and we experienced the same dilemma you are experiencing. We decided to finally bite the bullet and get ourselves some high speed placement machines and a pretty large convection oven but you pr
Electronics Forum | Fri May 14 15:28:39 EDT 2010 | timryder
I have an application I'm trying to solve which would allow me to vary voltage going to an Electric Solenoid at 24v ~3.0amps DC. What I want to do is create a device to vary the voltage going to the Solenoid using a pulsed digital input. I have a mot
Electronics Forum | Tue Aug 17 09:43:59 EDT 2021 | lay1014
Application of vacuum technology VACUUM FURNACE Metallurgical industry: The vacuum technology used in the metallurgical industry includes molten steel vacuum processing, vacuum melting, vacuum induction melting, induction shell melting, vacuum arc re
Electronics Forum | Wed Feb 25 08:34:00 EST 1998 | Earl Moon
CERAMIC CIRCUITRY Starting with hybrid thick film circuits in 1965 at Sperry Flight Systems, I have been involved with ceramics (usually aluminum oxide) as the substrate material. Then, we developed "multilayer" circuitry (replacing "cordwood" module
Electronics Forum | Wed Feb 25 08:30:44 EST 1998 | Earl Moon
| Happy Holidays All, | I am searching out a vendor (US preferred) who can fabricate a ceramic PCb with etremely fine lines. | Please reply if you are a vendor, or know of one. | Thanks, | Wendy CERAMIC CIRCUITRY Starting with hybrid thick film circ
Electronics Forum | Wed Jul 11 20:17:05 EDT 2001 | davef
I�ve written a review to be published in an up-coming SMTnet Newsletter of �Printed Circuit Assembly Design� Leonard Marks, James A. Caterina [Hardcover - 368 pages (July 26, 2000) McGraw Hill Text; ISBN: 0070411077]. In short, � In �Printed Circui
Electronics Forum | Tue Jul 24 19:26:20 EDT 2001 | johnmaetta
Thanks Dave. We develop high-speed telecom PCB assemblies that use uBGA and other fine pitch components. Our policy has been to use an NC process at our CM. Our engineering group, who is also a customer, and uses these assemblies for development,
Electronics Forum | Wed Aug 18 16:15:04 EDT 1999 | Earl Moon
| Hadco offers a technology of building in a "buried" capacitance layer (& other embedded passives) in organic PWBs (FR4 for example). see http://www.hadco.com/prod03.htm and a design manual is posted here: http://www.hadco.com/pdfs/bcguide.pdf | I
Electronics Forum | Sat Jul 22 04:52:31 EDT 2023 | shrikant_borkar
Here below clarification may help you I suggest you to refer IPC-AJ-820A Assembly and Joining Handbook for the entire information of applicable standards. IPC-J-STD (IPC-Joint Standard): IPC-J-STD is not a standalone standard; it refers to the serie
