Electronics Forum: high-speed applications (Page 3 of 4)

Screen Printer

Electronics Forum | Tue Aug 02 15:05:38 EDT 2011 | davef

A couple of points: * Just a nit, 'screens' fell in disuse 10-15 years ago. Old habits die slowly don't they? * Yes, DEK and MPM each hold about 50% of the solder paste printer market and about 4 or 5 others hold the rest. SOLDER PASTE PRINTER EQUI

Re: No Clean in High Frequency Apps

Electronics Forum | Wed Dec 09 10:02:10 EST 1998 | Earl Moon

| Does anybody out there have any special insights into utilizing no clean paste in high frequency RF applications? I would imagine there may be some issues with solder balls that would affect functional test (Earl, do you have something for me here?

Re: HASL - again?

Electronics Forum | Fri Jun 18 13:55:44 EDT 1999 | Earl Moon

| | Now don't everyone jump on this at once, but it seems time for me to send out copies of my not even close to being dated copy of an article about HASL. Though it was published in 1992, in Printed Circuit Fabrication Magazine, and it got rave revi

Re: Hi-Speed SMT manufacturing

Electronics Forum | Wed Feb 17 22:55:25 EST 1999 | Dave Kalen

| | SMT Mfg. Equipment: Fuji CP-6/IP-3 - but please all hi-speed chip placer users input are appreciated !! | | | | The company that I work for is a C/M which offers both consignment but mostly turnkey work. I am currently running 3 Fuji lines. All

Re: Simutaneous Double sided reflow assy

Electronics Forum | Thu Jul 20 17:01:26 EDT 2000 | Bob Willis

Here is some further information on SDSRS process, but please purchase a copy of the report from t he SMTA as all the money goes to charity. In the UK the SMART Group raised over �3000 for the homeless. SMTA have been raising a lot of money for the G

Re: SDRSS

Electronics Forum | Thu Jul 20 15:08:53 EDT 2000 | Bob Willis

Yes no problem here it is in a nut shell. The sponsor of my CD ROM on this process was Loctite who specifically developed a glue for the process to cure in less than 10seconds. Have a word with these guys they may even have a few CDs. PROCESS SEQUEN

Stencil Printing for 0201 Applications

Electronics Forum | Mon Sep 17 15:27:51 EDT 2001 | jschake

Challenges: The basic defects that impact assembly yield are bridging, satellite solder balls, and opens (i.e. tombstones / draw bridges). There are many variables with the stencil printing process that can impact these; several of them are listed

Re: Proflow of DEK screen printer

Electronics Forum | Wed Sep 08 08:25:26 EDT 1999 | Brad Kendall

Listed below are the issues Viking has been experiencing since the | installation of the Proflow Head: | 1. After installing new 350mm Wiper foil with metal | strip glued on it, It worked for about a week and suddenly meta

Solder Paste Evaluation

Electronics Forum | Wed Jan 11 22:47:31 EST 2006 | davef

We didn't intend to light anyone's fur on fire [get anyone's underwear in a knot, roil the waters, have a cow man] about consultants. The Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste

How to choose a new solder paste

Electronics Forum | Thu May 26 08:52:42 EDT 2011 | davef

Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste � Not An Option Contributed by Phil Zarrow of ITM an Independent SMT consulting firm With soldering being the dominant source of assembly


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