Electronics Forum | Wed Aug 30 00:16:15 EDT 2000 | Craig
We are reflowing ceramic resonators and are finding their tops falling/popping off when handling the pcbs during final assy. The epoxy seems to be coming off the components base and adherring to the lid. The components are "RFM resonators", case type
Electronics Forum | Wed Feb 10 23:48:14 EST 2010 | plaiming
Yes, I looked at the curve but it was high 250F max, but not higher than reflow oven temps..
Electronics Forum | Fri Oct 06 05:56:37 EDT 2000 | Alberto Silva
Hi, Instead of using High Temp solder, I would like to use a UV epoxy to atach termocouples to reflow profile boards. Does any one know a good one? Thanks in advance. Alberto
Electronics Forum | Thu Jan 02 20:55:00 EST 2025 | auriga2001
Not sure of the strictness of your contracting; but here's what you can do: Lower reflow temps. Try different temp solder paste on one side. Use epoxy under the part or water-soluble masking around it.- Do you have automated dispensers? You could rev
Electronics Forum | Thu Feb 21 15:26:58 EST 2013 | markhoch
I'd be leery curing the E-30cl Material at temps above 90 degrees C. (I believe the flashpoint is 93 Degrees C)
Electronics Forum | Wed Feb 21 14:18:37 EST 2001 | jagman
Could anyone please give me some insight on the time/temperature requirements for curing SMT adhesive used for a high temperature (96/4 solder) application in a bake oven, rather than using reflow? I understand that it would probably vary from epoxy
Electronics Forum | Tue Feb 08 16:09:09 EST 2000 | dean
Generally speaking with most electronic grade epoxies: 1. Cure time is a function of temperature. 2. Polymer bonds begin to quickly break down above certain temperatures (product specific). I believe aprox 170-180C. The strength of the bond de
Electronics Forum | Mon Apr 03 11:48:31 EDT 2006 | stepheniii
How big are the parts? I've only seen a few parts that ever fell off. Double sided reflow is probably the most common these days The surface tension is powerful. I think the lower limit of temperature is what you would have to worry about with epox
Electronics Forum | Wed Sep 21 20:03:34 EDT 2005 | kevinbooth
I am going to agree with Rob a little. It is also possible that a internal ground plane might be under or connected to the pads of this cap thus causing a increase in temp to this part during reflow. This can cause parts on occasion to jump from the
Electronics Forum | Wed Feb 21 20:40:44 EST 2001 | jagman
I appreciate both of your responses. I spoke with a tech rep at a distributor of the Loctite 3609 and asked him if this adhesive can be cured using a bake oven (Blue M, Despatch, etc.), rather than convection/IR. He stated that he's never heard of
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