Electronics Forum: hope (Page 253 of 341)

Re: PCI Press Fit on Daughter Cards

Electronics Forum | Wed May 19 14:09:29 EDT 1999 | JohnW

Wendy, I've done this before using a machined piece of FR4 material to hold the board (machined like a DEK plate )in place at the press . It ensures that the boards are alway's in the right place and that none of the components are damaged..also sto

Re: BGA's - Re-ball -- How thick?

Electronics Forum | Tue May 18 14:15:59 EDT 1999 | Scott McKee

| | What is the best way to re-ball a BGA? Who has the best system for doing it? | | | I'm using our SRT rework stuff to reball in house - when necessary. Of course, we only do this for protos and test boards. We use a standard micro-stencil, after

Re: BGA rework : IR or convection

Electronics Forum | Wed May 12 10:38:51 EDT 1999 | Glenn Robertson

| We are currently looking at purchasing some BGA rework equipment. Could someone give us the pro's and cons of IR heating (top/bottom)vs. hot air convection ? | All other tips are also welcome. | | Thanks | Philip, My experience is primarily wi

Re: BGA rework : IR or convection

Electronics Forum | Thu May 13 12:41:10 EDT 1999 | Eric

| | We are currently looking at purchasing some BGA rework equipment. Could someone give us the pro's and cons of IR heating (top/bottom)vs. hot air convection ? | | All other tips are also welcome. | | | | Thanks | | | Philip, | I have been doing

Re: BGA rework : IR or convection

Electronics Forum | Tue May 18 03:03:34 EDT 1999 | Philip B.

| | We are currently looking at purchasing some BGA rework equipment. Could someone give us the pro's and cons of IR heating (top/bottom)vs. hot air convection ? | | All other tips are also welcome. | | | | Thanks | | | Philip, | My experience i

Re: Cleanliness Testing/Conformal Coating

Electronics Forum | Tue May 11 07:50:52 EDT 1999 | Graham Naisbitt

| If I clean my assembly and find no visable contamination with the unaided eye, do I need to do cleanliness testing prior to conformal coating? | Douglas, It is highly advisable to test for ionic contaminants because a coating seals in as well as

Re: BGA ball size reliability

Electronics Forum | Wed May 12 20:32:14 EDT 1999 | Earl Moon

| Earl | | you posted a message on 1-14-99 about converting to VOC free flux. Have you completed your evaluation? Could I get a copy of any data supporting your conversion to VOC free? | | Thanks | | WDR | | WDR, We are awaiting the latest dat

Re: Problems with Ceramic Capacitor SMD In-Circuit Test

Electronics Forum | Thu May 06 01:37:56 EDT 1999 | Kallol Chakraborty

| I would like to know if someone aleady have problems with Ceramic Capacitors SMD in In-Circuit Test (see below)and how did you solve this problems ? | | PROBLEMS | 1 - Only one kind of capacitor (2n2F), of all capacitors on board, sometimes are o

Re: Setting up solder material evaluation (suggestions?)

Electronics Forum | Tue May 04 10:30:35 EDT 1999 | Dave F

| I am about to embark on an effort to evaluate 3 different solder material suppliers and their recommended materials for our assembly process, in an effort to find the best supplier/material. We do mixed technology, with NOCLEAN chemistry so I will

Re: Hand-Solder Pre-Heat

Electronics Forum | Fri May 07 02:37:31 EDT 1999 | Bob Willis

| Mornin! | | We just had vendor in here pitching a "low-temperature rework system" which was intriguing, but too expensive. He did get me to thinking though, beyond heating ceramic caps before hand-soldering them, it seems like it would be ad


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