Electronics Forum: hope (Page 263 of 341)

Re: Selective Soldering wih Drag Machine

Electronics Forum | Fri May 22 10:43:23 EDT 1998 | Mike Konrad

You're right Earl� Drag soldering is a dead issue as far as new technology is concerned. They do, however, work for most through-hole boards� but so do wave machines. There are only two manufacturers left that still produce drag soldering machine

Re: Posting technical articles

Electronics Forum | Thu May 21 17:16:03 EDT 1998 | Cunli Jia

| We applaude you for your fine efforts and providing us all a place to lodge our intelectual information. Some of us were talking and wondered if you might help us with a place to park some of our past technical (non commercial) articles as a way of

Re: Posting technical articles

Electronics Forum | Fri May 22 09:19:12 EDT 1998 | Chrys

| | We applaude you for your fine efforts and providing us all a place to lodge our intelectual information. Some of us were talking and wondered if you might help us with a place to park some of our past technical (non commercial) articles as a way

Re: Component Baking

Electronics Forum | Fri May 22 16:08:05 EDT 1998 | Steve Gregory

Hi ya' Mike! For low temperature baking, IPC-SM-786A (Procedures for Characterizing and Handling of Moisture/Reflow Sensitive IC's) specifies a low temperature bake that can be done in the component shipping packaging...ya' wanna remove the bubb

Re: Tin-Lead thickness on PWB's

Electronics Forum | Mon May 18 13:30:15 EDT 1998 | Earl Moon

| I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and solde

Re: Wrong Forum ?

Electronics Forum | Thu May 07 10:09:24 EDT 1998 | Cunli Jia @ SMTnet

| I thought this was a forum for equipment only. We were asked to take OUR messages off of the other SMTNet forum. I see many messages concerning process related issues that don't have anything to do about buying, selling or servicing SMT equipment

Re: VME Assemblies

Electronics Forum | Mon Apr 27 11:04:12 EDT 1998 | Dave

| I realize this is a SMT forum, but I have another | problem related to electronics assembly and hope there | will be someone out there that can save my life (this | time). | We build quite a few VME assemblies to which we attach | a SAM board. Fai

Re: Re: VME Assemblies

Electronics Forum | Mon Apr 27 07:37:42 EDT 1998 | Scott Davies

| | I realize this is a SMT forum, but I have another | | problem related to electronics assembly and hope there | | will be someone out there that can save my life (this | | time). | | We build quite a few VME assemblies to which we attach | | a SA

Re: READ THIS - PATENT LICENSE

Electronics Forum | Thu Apr 16 11:50:24 EDT 1998 | Gary Simbulan

| O.K., somebody read a probably hand-written 3 as 8. | Under these numbers, I can find at IBM's Patent Server the following other topics: | USP 4,312,692 | http://www.patents.ibm.com/details?patent_number=4312692: | USP 4,314,870 | http://www.pat

Re: temp stress reliability test for SMT solder bonds

Electronics Forum | Thu Apr 09 14:02:29 EDT 1998 | Earl Moon

| | I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to whe


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