Electronics Forum | Thu Apr 11 15:14:38 EDT 2013 | ericrr
JUKI KE-750L, A professional service person is coming next week, to fix a small list of items.
Electronics Forum | Thu Aug 20 08:23:23 EDT 2009 | ratsalad
One diagnostic tool that I have found useful in the past is the "hot plate test". Place suspect components and/or PCB's on a hot plate and turn it on High. Then observe. Granted the conditions on the hot plate are not the same as in a reflow oven,
Electronics Forum | Wed Feb 18 12:32:59 EST 2004 | babe
A hot plate should do it. Since your throwing the board away a good hot plate could get you to just above reflow topside and you could remove them all at one time. To do this however the bottom side of the board would probably be damaged, but you don
Electronics Forum | Mon Aug 24 21:43:28 EDT 2009 | davef
In reworking 0201, we: * Cut the 0201 in half with a side cutter * Heat the solder on each pad separately and flick the half 0201 off the board * Preheat a new component to +150°C with a hot plate * Solder a new 0201 on the undressed pads with a hot
Electronics Forum | Thu Dec 17 03:25:00 EST 2009 | tod1967
Not sure if Multicore/Henkel still offers it, Prozone is an outstanding chemistry for RMA removal. Heated to a relatively low temp. No Ultrasonics necessary. Could use a Pyrex Beaker Hot and Hot Plate to test.
Electronics Forum | Wed Oct 08 11:18:41 EDT 2014 | wavemasterlarry
If its like my wave, the t-couple might not be mounted over a whole where the hot air blow out./ mounting it on the hot plate makes it over heat alot.
Electronics Forum | Fri Nov 22 17:55:39 EST 2002 | robertorre
Your problem may be related to different aspects. 1. Oxidation on landing pads. 2. Either high(To long over liquidous temp) or low temp. 3. Bad solder (not enough vehicles) Run this test: Set a hot plate to 220 degrees C. Make sure you have proper ve
Electronics Forum | Tue Aug 05 01:13:22 EDT 2008 | Sean
Dear all, As far as I know hot tear or shrink hole defect only happen at plated though hole soldering, especially for those lead free wave process. Recently, a laboratory engineer had done cross section on some of the SMT BGA ball and IC lead solde
Electronics Forum | Thu Jun 26 08:49:21 EDT 2003 | caldon
Depends on your Material (Chemistry) and Machine. We use a hot plate with the material in an "L" patern. The Hot plate is used only in aiding the capillary action. Also, is time an issue?? Here is a good paper from Asymtek that was poster in Advan
Electronics Forum | Tue Oct 19 10:53:14 EDT 1999 | Carol Zhang
Hi, I tried to use high temperature solder (540 - 570F)to connect four spacers on the board. The solder mask around the spacers wrinkled a lot.I can even see a few bulbs around it. I use hot plate and solder rings. After hot plate is heated to appr
