Electronics Forum | Fri May 26 04:58:19 EDT 2023 | auriga2001
I agree with the two other replies. Left alone, it is a defect. If it's just excess adhesive or coating, you can use IPC-7711/7721 'Rework, Modification and Repair of Electronic Assemblies' for guidance on removing. Section 2.3.1 explains how to te
Electronics Forum | Tue Oct 21 17:23:50 EDT 2008 | ck_the_flip
Bong, How's the business in the Philippines? I hear it's a new hot spot for Electronics Manufacturing Services.
Electronics Forum | Wed Dec 13 08:56:49 EST 2000 | CAL
One other piece would be to map of the hot spots in the US market. California, NE, SE, Chicago and Texas are hot spots for Electronics manufacuring. Target companies in these areas and hit them with resumes. Some areas are starved for manufacturing e
Electronics Forum | Fri Aug 12 08:13:12 EDT 2011 | rway
The only thing I see that might be a fuse is the green vertical axial leaded component next to the third from the bottom white 4-pin header. It's labeled ?718 or 710. I don't know if this is a resistor or a pico fuse. You can try to ohm it out. An
Electronics Forum | Tue Aug 09 22:49:52 EDT 2011 | rway
Start by checking for hot spots on the cpu board if possible. An IC may have blown or shorted internally. It's probably a driver chip for the print head. But that doesn't explain why the display doesn't work, but if it's overloading the power supp
Electronics Forum | Mon Aug 29 22:48:09 EDT 2011 | davef
Rich Here's what Humiseal says: Thermal Properties The coating must be able to withstand localized thermal 'hot spots' generated by components. High temperatures can cause short-term changes in coating characteristics, such as softening and lowered e
Electronics Forum | Wed Jun 25 12:08:53 EDT 2003 | russ
I battle this all the time, I don't believe that it is the "gold corner" that is causing the problem but something with the PCB layer makeup (copper planes, or bottom side components, etc.). It could also be the nozzle you are using has a "hot spot/
Electronics Forum | Fri Nov 06 15:42:58 EST 2015 | sdmideas
I am having a darn hard time getting my upward vision to successfully inspect a ssop14 package. I have created a part profile as defined by the manual as I understand. I believe the profile is ok based on comparison to like parts referenced in the q
Electronics Forum | Mon Jan 03 09:58:29 EST 2005 | Dave J
One of the difficulties with BGA rework is excessive heating of the internal package (die) temperature. We have several "SRT" hot air rework systems which work well, but with Pb-Free components the challenge becomes even greater. The question I have
Electronics Forum | Wed May 26 18:04:16 EDT 1999 | John Thorup
| After reflow proces in convection-IR oven we find broken body of SOT23 elements. There is no problems on other elements (SOIC, chip R,chip C, etc) | Where is the problem? | | Thanks in advance! | Check your profile at the site of cracked component
