Electronics Forum | Tue Apr 20 17:56:42 EDT 1999 | Chrys Shea
| | I am wondering if anyone has any info regarding solder paste misprint clean-up procedures for Entek Plus CU-106A PCB's utilizing a water-clean solder paste. In a implementation procedure they recommend a 2-3 minute wash cycle with the following
Electronics Forum | Tue Apr 20 22:09:03 EDT 1999 | Earl Moon
| | I am wondering if anyone has any info regarding solder paste misprint clean-up procedures for Entek Plus CU-106A PCB's utilizing a water-clean solder paste. In a implementation procedure they recommend a 2-3 minute wash cycle with the following
Electronics Forum | Mon Mar 08 20:17:41 EST 1999 | Michael Larsen
| | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | Concerning the BGA stuff, I'm getting about 60% success using
Electronics Forum | Sun Jan 31 03:28:24 EST 1999 | Jeff Sanchez
| Hello Netters, | | I need some info, Earl or Dave, I have a PCB that exhibits a white layer on solder side. It does not appear to be surface residues (IPA has no effect), but looks like its under solder mask. My first guess is that the LPI solde
Electronics Forum | Tue Dec 08 18:40:04 EST 1998 | Graham Naisbitt
Hi all, Only observation I would make is that it depends upon what you term as clean? Now isn't that an old thorny question. Care to comment? Regards Graham | Hey there Dave! | | We used to use a batch cleaner when we used water-clean paste.
Electronics Forum | Tue Nov 03 16:28:21 EST 1998 | Dave F
| Well my process is I'm running my belt speed at 3.50fpm and about 215 to 225 degrees top side. I got my main wave down to a little less than half the board thickness. I'm not using a hot air knife cause we thought it might create more of a problem
Electronics Forum | Wed Nov 04 02:53:53 EST 1998 | Earl Moon
| Micheal, | | What does your profile look like for the wave? What profile does your flux say you need? My guess is it is not your profile, our testing with solder balls found that the mask on the boards was the largest contributor to solder balls
Electronics Forum | Tue Jul 28 09:15:49 EDT 1998 | Justin Medernach
| We are about to run our first BGA devices and would appreciate some confirmation on a few points. | First some details: | PCB & Device: | ============= | 1) 16 layer (4 power, 4 gnd, 8 signal) | 2) gold on nickel finish | 3) ceramic BGA with eutec
Electronics Forum | Thu Apr 04 05:33:19 EST 2002 | ianchan
Hi, hope this helps : 1) BCC (bump chip carrier) production for us, was with a 5mils Stencil. The outer perimeter smallish pads are not much of a problems. For the central large pad, we split the paste print (corresponds to the Stencil apperture op
Electronics Forum | Wed Jul 03 11:37:36 EDT 2002 | fmonette
Dason, I apologize if some of the information sounds redundant but I don't think I explained my point very well (and the standard can get really confusing at times). I definitely agree with using C-SAM to look for internal defects. My only advise i
