Electronics Forum | Mon Apr 26 16:06:32 EDT 1999 | Chrys Shea
Hey - remember the evaluation of VOC-Free fluxes that I promised a couple of months ago? well, I finally scrounged up the time to remove the propreitary (board name and number) info from the report. So it's ready. I posted it in the SMTnet library
Electronics Forum | Wed Jul 22 07:20:12 EDT 2015 | spoiltforchoice
I'm not entirely sure that is accurate. The only people who want small 'desktop' machines are hobbyists/labs who are unable to accept the costs and time constraints placed upon them by a subcontractor and think they can do better themselves. Standalo
Electronics Forum | Sat Nov 17 12:58:12 EST 2007 | mika
I agree with previous postings regarding print speed: Solder paste type/versus fine pitch. Question: Is this a double sided pcb with fairly easy component packages on both sides? In such case, consider make the panel like this: Every second pcb in
Electronics Forum | Mon Apr 26 21:29:34 EDT 1999 | Dave F
| Hey - remember the evaluation of VOC-Free fluxes that I promised a couple of months ago? well, I finally scrounged up the time to remove the propreitary (board name and number) info from the report. So it's ready. I posted it in the SMTnet libra
Electronics Forum | Tue Aug 21 08:44:48 EDT 2001 | caldon
A) The standoff height of some uBGA components does not allow water to penatrate under the component. B)Water soluable may dilute the flux and not remove it all together. This can be tested with Ion Chromatography. C) Water soluable in some cases ne
Electronics Forum | Fri Sep 28 02:48:46 EDT 2018 | teresat2
Principle A layer of photosensitive material (photosensitive oil or dry film) is applied to the copper foil on the board surface, and PCB manufacturer should be use the position is exposed by black film, This applies to most PCB factories, especially
Electronics Forum | Thu Nov 18 03:54:49 EST 1999 | jacky
Hello,everyone, I want to know how I can test the reliability of the solder point.And now we just push or pull the components to test the reliability of solder point,but I don't know if there is any measure of the power applied to the component
Electronics Forum | Tue Mar 14 14:13:14 EDT 2017 | cyber_wolf
I don't have an answer but I am curious. What data/testing shows that this voiding is detrimental? How did the auto industry arrive at
Electronics Forum | Wed Feb 19 15:16:35 EST 2014 | jlawson
Gerber in general is not best data set for assembly, alot of processing has to be done, manually or via software tools, all with their nice features, but as you state there is no actual datum XY , pin 1 , rotation references thus has to be 'generated
Electronics Forum | Thu Jun 08 01:46:00 EDT 2023 | camilleyang3
To prevent BGA (Ball Grid Array) issues related to SMT (Surface Mount Technology) solder resist when fabricating a PCBA (Printed Circuit Board Assembly), you can follow these guidelines: Design considerations: Ensure proper spacing between BGA pads
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