Electronics Forum | Mon Jul 06 18:00:16 EDT 2015 | jwqc
Does any one know how to calculate BGA height change after reflow oven? I guess the calculation will be based on the component size, weight, ball diameter and ball count of the BGA, but how to get the actual height?
Electronics Forum | Tue Jul 07 10:25:03 EDT 2015 | swag
Dial indicator on a post/base. You might need a fine point tip to get between adjascent components and the BGA. Or... if you're real fance schmancy you could use a CMM if you have one.
Electronics Forum | Fri Mar 23 07:34:11 EDT 2007 | davef
Cost per placement = [Equipment cost/5 years/components placed per year] + [Working capital/ components placed per year] + [Expenses/components placed per year]
Electronics Forum | Tue Jun 26 19:59:08 EDT 2001 | davef
They always tell you to calculate ROI, when they want to blow you off. Do a net search using - calculate ROI. Links to three pretty good descriptions on this are: http://www.dmreview.com/editorial/dmreview/print_action.cfm?EdID=2487 http://www.eval
Electronics Forum | Mon May 07 16:07:05 EDT 2012 | davef
Start with targets based on the stencil thickness (for height) and stencil thickness times the aperture size (for volume). * Set reasonable upper and lower control limits (+ 25% and –25 % of the targets, for example). * Next, check the printer set-u
Electronics Forum | Mon Jan 02 09:39:34 EST 2017 | dyoungquist
I do not know the limit for component height on Hydra.
Electronics Forum | Fri Dec 30 09:52:24 EST 2016 | emeto
Thanks, I will try that and we will see how it goes. Do you know what is the limit for component Height for Hydra heads?
Electronics Forum | Fri Jan 30 00:41:04 EST 2015 | neeraj_iiser
Thanks a lot , my application is cryogenic in nature. I am trying to make a Sub-Angstrom resolution Thermal expansion sensor, whose components have been machined out of OHFC copper, and i needed to solder a manganin wire to one of the capcitor plates
Electronics Forum | Mon Nov 06 14:21:09 EST 2000 | Kevin
Masking thickness can also play a factor in tombstoning (or the Manhattan Effect). If the pad is 2 mils or more below the surface of the masking this can create a problem. Depending on the thickness of the solderpaste deposition, the solder height
Electronics Forum | Tue May 21 17:16:51 EDT 2002 | davef
Larry, Yes, no matter how much you�d like to avoid using NC, you probably will have to start using the stuff, if the design [sales, in your case] types have their way. We can clean WS under 1mm and 1.25mm pitch BGA. For 0.8mm pitch BGA, we use NC.
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