Electronics Forum | Tue Aug 30 10:48:18 EDT 2005 | cmiller
If you do not have a lot of TH joints there are some advantages. No boards "submarined" in solder pot on wave. You can solder the bottome side SMT parts rather than epoxy them when the parts are put down. This should reduce SMT defects and missing pa
Electronics Forum | Mon Aug 29 11:47:25 EDT 2005 | stalkerb
Do you have expierience of this type of Machine. approx how many product types are you running on your wave/ersa...? and approx batch sizes We have had a 5060 for about 1 year and it has been a revalation. your input is appreciatted as i am consi
Electronics Forum | Thu Sep 01 01:21:05 EDT 2005 | cmiller
PS, sorry for any confusion, ALDSMT and CMILLER are both me. ADLSMT is my user name on SMTNET and CMILLER is me, cmiller@adltech.com I usually use cmiler to reply to stuff as if anybody e-mails me it makes more sense. adltech.com is a work in progr
Electronics Forum | Sun Oct 05 03:30:03 EDT 2003 | christ
Hi all, We found there were some non-clean residue left on the PCBA,in all likelihood,they were rosin which couldn't be soldered enough,so I wish all of you can give me hints how to clear them out during soldering by correct reflow profile. BEST
Electronics Forum | Mon Oct 06 10:04:29 EDT 2003 | davef
Excess low residue flux is very dangerous to leave on your finished assembly, because it can: * Be corrosive to your solder connections * Promote dendrite growth. To prevent this, follow your supplier's recommendations on: * Applying the proper amou
Electronics Forum | Thu Oct 09 15:57:00 EDT 2003 | davef
Start your recipe development with the recommendations of your paste supplier. The recipe in your new oven should produce identical results to your old oven [assuming you're using the same paste]. Given that your new oven is shorter than your old
Electronics Forum | Tue Jul 05 15:21:46 EDT 2005 | russ
So your thermal cycling test is putting these solder joints into reflow (183C + if they are lead joints)? Must be quite the test! Tell us what pad sizing and spacing you are currently using.
Electronics Forum | Sun Mar 07 17:53:39 EST 2004 | Ken
Increasing the metals loading may help. But may cause issues elsewhere. Unsure of your exact process....but may work. Is anyone dispensing solder paste onto BGA pads...how is voiding in comparison???
Electronics Forum | Wed Nov 23 16:24:26 EST 2016 | misterblonde
Hello, I am new to this forum, and was hoping to get some advice/information from those of you that have switched your wave soldering machine to SN100C. I have read some old threads about people having great success with SN100C. My question is- w
Electronics Forum | Wed Oct 08 08:30:21 EDT 2003 | christ
Hi Dave: I'd second you.Thanks for your effort and can you give me the hints about correct reflow profile for soldering PCBA.I doubt there was something problem during reflow,I found there were some flux residue left on the PCBA after reflow by th
