Electronics Forum | Sat Mar 06 06:15:14 EST 2004 | Bryan
Thanks Tommy. In fact I've tried many types of profile,but it didn't work.I'll try to make the peak temp. as low as 205C and dwell long as in some threads Dave said.I've tried baking the BGA and PCB before mounting also dindn't work.yes,I've heard th
Electronics Forum | Fri Jul 29 19:12:30 EDT 2005 | Jason Fullerton
In the true sense of the term, tombstoning can only occur during reflow. Now, if your solder joints are cracking during thermal cycling and opening on one end you still have a problem - it just isn't "tombstoning". What laminate are you using on yo
Electronics Forum | Tue Nov 14 14:08:44 EST 2023 | hhudson
Good Morning, I'm a relatively new engineer, and i've been experiencing a lot of anomalies when it comes to our inline wash. We have an Austin American Hydrojet, and no matter how many times i clean the tank, it still foams like crazy! its been happe
Electronics Forum | Sat Oct 06 08:32:09 EDT 2001 | davef
Mr. Wizard is not currently available. You get the wizzer. Maybe your dream date will show later. Get your own lab tests done. Show your potential customer that your boards are clean. That�s the issue. The issue is not how you go about cleaning
Electronics Forum | Thu Jan 26 17:59:07 EST 2006 | GS
How is RH% inside your Dry Cabinet ? What is the most critical MDL of your MSDs soldered on your board ? Best instructions about Handling of MSD you can get from Standard J-STD-033B/C. The defects you encountered at test it could be moisture absor
Electronics Forum | Wed Apr 28 06:26:15 EDT 2021 | jeremy_leaf
@Evtimov I can't use flux as the components being soldered can't cope with any contamination whatsoever. Even an ultra low solids no-clean flux will be too much. I also can't clean the boards after soldering due to any residual contamination from the
Electronics Forum | Tue Apr 27 19:08:04 EDT 2021 | emeto
Jerry, just out of curiosity, why can't you use flux? Flux is essential part of soldering and it is there for multiple reasons. Flux we can also clean afterwords - even No Clean.
Electronics Forum | Mon Aug 05 17:50:20 EDT 2019 | travishemen
We have a Rehm oven that can vibrate hard enough to shift parts on the board. The vibration is due to flux build up on the exhaust blower. If we don't clean it regularly we start to see parts shifting in the oven.
Electronics Forum | Wed Aug 07 11:21:28 EDT 2019 | charliedci
The melting of the solder during reflow itself can center up or skew a component. This could be pad size differential, incorrect pad size, unequal solder deposition amounts, pad spacing in reference to component size just to name a few.
Electronics Forum | Tue Apr 13 11:41:18 EDT 2021 | jeremy_leaf
I have a SAC305 preform with which I am attempting to bond a gold coated component to an ENIG coated PCB pad. I've specified 2 microinches of gold for the ENIG. It worked previously but now with a new batch of boards, I am having an issue where the p
