Electronics Forum: how to clean resin in soldering (Page 5 of 12)

What to look for in a BGA Lab analysis

Electronics Forum | Wed Mar 04 11:20:19 EST 2015 | jorge_quijano

Hola, I'm about to evaluate our BGA capabilities by using a dummy PCB+Components kit, I'll be evaluating solder paste, pick n place, reflow process & rework method. I have an idea of how to validate these processes. I'm planning to send different sa

How to identify any Vibration Source in Reflow Oven

Electronics Forum | Wed Aug 07 17:00:04 EDT 2019 | davef

I agree with Chariem. Take a look at this thread [posted by the same author as this thread] on SMTnet: Component Skew during Reflow Process [ https://smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=22131&mc=7 ] The

SAC305 preforms not wetting to ENIG pad in fluxless process

Electronics Forum | Wed Apr 14 19:47:13 EDT 2021 | solderingpro

Sounds like you may have already found the issue: inconsistency from your supplier. Seeing as Gold really doesnt oxidize and you're using an inert environment (N2 I suspect), I would turn my attention to the supplier. You said yourself, the "Shine

Re: How long to burn in a circuit board

Electronics Forum | Mon Feb 14 12:07:47 EST 2000 | Dave F

Leslie: Product screens and tests of prototypes and test vehicles should be tailored for the specific goal and product. I caution your use of equations and test condition information without specific use environments and design conditions. Lawyer:

How to associate the patterns in SPC charts to the root causes o

Electronics Forum | Thu Apr 03 09:27:04 EST 2003 | davef

First, welcome to SMTnet. On your question, are you talking about control charts? If so, here's some background on control charts http://deming.eng.clemson.edu/pub/tutorials/qctools/ccmain1.htm What are you plotting: * Independant variables? * De

Foam in inline wash

Electronics Forum | Thu Mar 21 09:23:35 EDT 2024 | alishakihn

Good morning! I'm sorry to hear about the anomalies you're experiencing with your inline wash. Dealing with foaming issues can be challenging, but I'll do my best to provide some suggestions to help you troubleshoot the problem. 1. Check the Water Q

voids in solder

Electronics Forum | Wed Feb 28 19:44:50 EST 2001 | pzohbon

I am having problems with voids in our soldering process. I believe it to be the fact that we use a no clean flux without control on how the boards are handled (gloves, procedures, etc.) Does anyone have suggestions on the appropriate place to start?

No Clean OSP process cause ICT testing issue due to Flux building in testvia hole

Electronics Forum | Thu Apr 04 09:45:58 EDT 2019 | davef

That's what I guessed. Some ideas to consider are: Reduce usage of flux to the bare minimum. Choose a low solids flux Flux residues can be categorized as soft, brittle, sticky but this depends mostly on the formulation of the flux and the resins

Porosity in Good Plating

Electronics Forum | Fri Jul 04 12:32:33 EDT 2003 | sam

I need some advice about a problem that happened in a SMT LED: The failure symphoms of this SMT LEDs is that the LED body itself seemed to be functional, but when soldering on the products, it showed good wetting and soldering, LEDs are bright and l

How to clear nozzle hight detected error in NPM W machines

Electronics Forum | Thu Mar 28 19:36:21 EDT 2024 | linux

ensure the nozzle is inserting fulling into the nozzle holder. ensure shaft is lubricated, clean between the magnetics on the shaft. complete nozzle height calibration


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