Electronics Forum: how to clean resin in soldering (Page 6 of 12)

No Clean OSP process cause ICT testing issue due to Flux building in testvia hole

Electronics Forum | Thu Apr 11 00:54:49 EDT 2019 | SMTA-Vikram

Yes, we have try different Flux, probes. etc... also not to paste vs Paste Via, but still we have ~3% NDF due to contact issue. I am looking for selective pasting with less flux dispenser.Any idea or anyone has used? What about plug via before pas

No Clean OSP process cause ICT testing issue due to Flux building in testvia hole

Electronics Forum | Fri Mar 29 07:53:12 EDT 2019 | davef

Why are you printing paste on test via? In the old days, we probed soldered pads to cushion impact force of probing. Is that still a reasonable practice?

No Clean OSP process cause ICT testing issue due to Flux building in testvia hole

Electronics Forum | Wed Apr 03 19:02:16 EDT 2019 | SMTA-Vikram

We still use Via as test points. so we need to paste Via. Pasting will make better contact with probes compare to test via without solder.

No Clean OSP process cause ICT testing issue due to Flux building in testvia hole

Electronics Forum | Fri Jun 07 05:19:23 EDT 2019 | gregoryyork

dont usually see this unless the Rosin hasnt been hardened due to low reflow or excessive pressure on blades squeezing flux out so you have flux rich areas. Are these boards also flow soldered?

When to use gloves

Electronics Forum | Sun Aug 13 00:15:58 EDT 2017 | deanm

We manufacture low volume, high reliability assemblies (class 3) that are conformal coated. Up until now we have been cleaning after SMT, then after through hole, then immediately prior to coating with test, formal inspection, etc. between cleaning p

Re: Soldering to Gold

Electronics Forum | Sat Sep 18 04:42:52 EDT 1999 | Brian

Dave, I'll respond by paragraph: | | | Brian: | | I like Ag2 also. I prefer it over both 63/37 and 60/40, if the price is not a factor. Yes, gold rips through eutectic and near-eutectic solders like habanero slathered shiitake burritos through

Re: Soldering to Gold

Electronics Forum | Sat Sep 18 12:27:21 EDT 1999 | Earl Moon

| | | Dave, I'll respond by paragraph: | | | | | Brian: | | | | I like Ag2 also. I prefer it over both 63/37 and 60/40, if the price is not a factor. Yes, gold rips through eutectic and near-eutectic solders like habanero slathered shiitake

How to Differentiate Class 3 and Class 2 products in terms of process

Electronics Forum | Sat Jan 10 09:04:47 EST 2015 | jandon

class 3 requires 100% barrel fill Class 3 requires 75% vertical fill of solder for component with less or more than 14 leads. Not 100% fill.

How to Differentiate Class 3 and Class 2 products in terms of process

Electronics Forum | Tue Dec 30 09:31:52 EST 2014 | rgduval

I've always approached it like this: Design your processes and perform your work to class three standards, and inspect to the standard that is acceptable. That is, all work should be performed to the highest degree of quality. When the work is ins

Re: Soldering to Gold

Electronics Forum | Sat Sep 18 13:05:57 EDT 1999 | Brian

| | | | | | Dave, I'll respond by paragraph: | | | | | | | Brian: | | | | | | I like Ag2 also. I prefer it over both 63/37 and 60/40, if the price is not a factor. Yes, gold rips through eutectic and near-eutectic solders like habanero slath


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