Electronics Forum | Sat Sep 18 13:05:57 EDT 1999 | Brian
| | | | | | Dave, I'll respond by paragraph: | | | | | | | Brian: | | | | | | I like Ag2 also. I prefer it over both 63/37 and 60/40, if the price is not a factor. Yes, gold rips through eutectic and near-eutectic solders like habanero slath
Electronics Forum | Thu Feb 28 16:40:04 EST 2002 | liviuj
>Dear SMTneter, >>I am loonkig for some information about how to rework a >>BGA. >>Some technical info explaing how to put solder past >>manualy, soldering manualy, tips and so on. >>Where can I find something about? >>Thanks in advance >>Marcos Hi
Electronics Forum | Wed Dec 08 12:48:01 EST 1999 | Chuck C.
Is anyone out there having problems with noise in analog circuits caused by the residue that no-clean solder paste leaves after reflow? If so do you have any suggestions on how to eliminate the problem??
Electronics Forum | Mon Sep 24 11:12:56 EDT 2001 | nwyatt
Hi. We are currently using an unconventional method to rework a micro BGA - removing component with hot air, fluxing the area, placing the part with pick and place, then reflowing it in the oven. The reason we are doing it this way and not with a r
Electronics Forum | Mon Sep 24 17:38:18 EDT 2001 | mparker
First question - do you have a rework station? If so, are you experiencing the same type of failures there? I have successfully used no-clean on uBGA's in the past. 6 mil solder bumps, 10 mil spacing. 88 sites. Are you reusing previously soldered uB
Electronics Forum | Sat Jan 16 03:06:36 EST 1999 | Wirat S.
| | Our spec on voids is 30% ball diameter in the center. On the component to ball and pad to ball interface, we use 25%. To determine this spec, we asked around. I don't know of any studies that have been done to verify if this is OK | | | | Regard
Electronics Forum | Mon Apr 17 19:46:39 EDT 2000 | Dave F
Murad: Your customer is smart to be concerned about the affect of changing production processes on product reliability. Your Company is smart to inform customers and keep them in the loop about these changes. In developing your demonstration of th
Electronics Forum | Thu Jan 28 10:09:51 EST 1999 | Charles Stringer
| | | | Greetings, | | | | | | | | Can anyone tell me what temperatures pcb's should have when coming out of a forced convection reflow oven and out of a wavesoldering machine. | | | | Also, is there any danger of the pcb's giving off some kind of g
Electronics Forum | Thu Jan 28 17:37:00 EST 1999 | Earl Moon
| | | | | Greetings, | | | | | | | | | | Can anyone tell me what temperatures pcb's should have when coming out of a forced convection reflow oven and out of a wavesoldering machine. | | | | | Also, is there any danger of the pcb's giving off some k
Electronics Forum | Thu Jan 28 17:37:02 EST 1999 | Earl Moon
| | | | | Greetings, | | | | | | | | | | Can anyone tell me what temperatures pcb's should have when coming out of a forced convection reflow oven and out of a wavesoldering machine. | | | | | Also, is there any danger of the pcb's giving off some k
