Electronics Forum | Sat Nov 08 07:05:12 EST 2008 | davef
Often, your solder paste supplier provides guideline on handling their solder paste. For instance: http://www.aimsolder.com/techarticles/tech%20sheet%20paste%20handling.pdf We have no relationship, nor receive benefit from the company referenced ab
Electronics Forum | Fri Nov 07 23:40:41 EST 2008 | padawanlinuxero
I have been working on the SMT area for a while now, must of my experience is on programming and pick and place, now in my new job I have to control a complete SMT line and I have a little knowledge on working with solder paste but I like to read mor
Electronics Forum | Tue Sep 23 07:27:31 EDT 2008 | realchunks
Do not wipe the board at first before putting it in your cleaner. It will leave more paste in your tank, but you won't smear it into every corner of your solder resist. We found that only our stencil cleaner would clean a board properly and leave n
Electronics Forum | Mon Sep 22 04:59:10 EDT 2008 | fadzil66
I have concern about cleaning solder ball after misprinting paste on PCB, currently use vigon 200 with ultrasonic generate but only 70% solder ball able to remove, Any other method or equipment can help to clean solder ball.
Electronics Forum | Tue Sep 23 20:56:08 EDT 2008 | davef
For additional information, download IPC-7526 - Stencil and Misprinted Board Cleaning Handbook http://www.ipc.org/html/IPC-7526.pdf
Electronics Forum | Tue Sep 23 14:13:29 EDT 2008 | slthomas
In piggy back on Chunks' comments, what you might wipe it with can be the problem. Alcohol absorbed by the solder paste inhibits the effectiveness of some cleaning chemistries, and driving it into the nooks and crannies exacerbates the problem. If
Electronics Forum | Tue Jan 25 13:06:47 EST 2000 | Bill Schreiber
When switching from cleaning RMA to a no-clean flux, one area that is commonly overlooked is the stencil cleaning operation. Stencil cleaners that are effective in cleaning RMA often fail when cleaning no-clean (especially alcohol cleaners). Pallet
Electronics Forum | Tue May 21 17:16:51 EDT 2002 | davef
Larry, Yes, no matter how much you�d like to avoid using NC, you probably will have to start using the stuff, if the design [sales, in your case] types have their way. We can clean WS under 1mm and 1.25mm pitch BGA. For 0.8mm pitch BGA, we use NC.
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
Electronics Forum | Thu May 26 08:52:42 EDT 2011 | davef
Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste � Not An Option Contributed by Phil Zarrow of ITM an Independent SMT consulting firm With soldering being the dominant source of assembly
