Electronics Forum | Wed Apr 19 04:41:42 EDT 2006 | ge_lim
Hi I am using selective soldering to dip soldering the connector pins to the PCB and would like to know your experience: a) Is there a recommended dip or dwell time for the dip soldering? b) How do we improve the solder coverage in the TH? c) How t
Electronics Forum | Thu Apr 20 08:49:08 EDT 2006 | Chunks
a) Is there a recommended dip or dwell time for the dip soldering? Check your data sheet for the part. Dwell time is everything in selective soldering. Top side wetting is a good process indicator. b) How do we improve the solder coverage in the
Electronics Forum | Thu Feb 15 12:32:14 EST 2007 | Eric D
one of my customer areworried about the flux risidue in the blind vias, or if the plug the vias and there is air trapped the plug will blow during our process. Appreciate for your response
Electronics Forum | Thu Feb 15 13:49:10 EST 2007 | russ
only plug one side, you can definitely blow out during reflow process with a sealed via/ it is impossible for flux to be trapped in a blind via. Russ
Electronics Forum | Tue Feb 20 09:47:20 EST 2007 | russ
thank you very much Dave! I really appreciate the feedback. I brainlocked on soldering assembly process. Russ
Electronics Forum | Mon Feb 19 22:56:20 EST 2007 | davef
Russ We agree with your comments on plugging from one side only. But... We believe that it IS possible to trap process chemicals [technically, not flux] in a blind [or any other] via. This can be done by plating the via closed, rather than pluggi
Electronics Forum | Mon Jan 30 19:27:50 EST 2017 | jgo
Hi all, I'm wondering how does one decide to use flux dipping or solder printing when it comes to be attaching CSPs onto the board? Solder printing has an advantage in that there will be a higher throughput on the mounter as there is no flux dippin
Electronics Forum | Tue Jan 31 09:10:04 EST 2017 | Rob
Hi Joshua, We've done both, but a lot depends on what soloution your machine vendor has, and how good it is. Can you add it into your machine acceptance criteria? Rob.
Electronics Forum | Tue Jan 31 19:34:11 EST 2017 | jgo
I have solder bumps diameters @ 80um, the board pad size @ 100um. Can this size be printed? How about dispensing?
Electronics Forum | Sat Oct 09 03:45:34 EDT 1999 | Brian
| Right now,we have some problem on SMT. Cause of the flux residue | in the connector. Do somebody have the same symptom? By the way, | can i find something to make the flux observe easy or take a photo with the flux. | | | Unfortunately, this pr
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