Electronics Forum | Tue Feb 19 12:28:26 EST 2019 | slthomas
Presumably you're talking about lead free, but you don't say. Heller can probably provide you with a starting point, as rob has already pointed out, but you do need to develop the capability to perform profiling yourself. That oven should have ECD
Electronics Forum | Tue Feb 19 08:41:02 EST 2019 | prasanth
dear experts, i want your suggestion for getting a profile in Heller 1707 mk iii series re-flow machine ,its 7 zone machine recently we had a solder ability issues , so pls guide me ,how to set rts profile parameters
Electronics Forum | Fri Jun 03 14:55:15 EDT 2005 | Bman
Both our Quad ZCR and our Conceptronic HVN-102 ovens have had blowers out with no alarms raised. We knew there were problems based on how boards were soldering, but don't count on your oven to tell you if anything is wrong with it. We verify once a
Electronics Forum | Fri Jun 03 04:16:27 EDT 2005 | Bryan She
Background: We use a thermal boards to setup/profiling the reflow oven for pilot run.and then daily verify the reflow profile with this thermal board.Now we phased into LF production,and the LF thermal board can only withstand 25~30 times reflow excu
Electronics Forum | Fri Jun 03 09:00:06 EDT 2005 | russ
How many times have you found that your oven was performing differently? this will give you the answer on frequency. We have a dedicated board and profile that we use to verify the oven operation. We perform this every 3 mos. and I believe that th
Electronics Forum | Tue Sep 02 09:09:11 EDT 2008 | allan99
Good morning everybody! I'd like to receive from you articles or tutorial links teaching how to develop a reflow profile and its process variants, I'm a new user from SMTnet forum and I can see profesional with grate knowledgment. thanks in advance
Electronics Forum | Mon Jul 01 09:33:08 EDT 2019 | dbuschel
if you can't change the PCB materials or design at this point, you might be able to reduce it somewhat through the use of fixtures or edge stiffeners. Unless it is a particularly thick board, I don't think the reflow profile would be the issue. The t
Electronics Forum | Mon May 13 06:15:12 EDT 2019 | dhanish
how to control warpage on panelized pcb during reflow process.we are already running with pallet.Encountering problem to insert the pcb into pallet after first reflow cycle.The insertion is being done by robotic arm. Any recommendation on the profile
Electronics Forum | Tue Jul 28 17:23:58 EDT 1998 | Robert Steltman
| | We are about to run our first BGA devices and would appreciate some confirmation on a few points. | | First some details: | | PCB & Device: | | ============= | | 1) 16 layer (4 power, 4 gnd, 8 signal) | | 2) gold on nickel finish | | 3) ceramic
Electronics Forum | Tue Jul 28 09:15:49 EDT 1998 | Justin Medernach
| We are about to run our first BGA devices and would appreciate some confirmation on a few points. | First some details: | PCB & Device: | ============= | 1) 16 layer (4 power, 4 gnd, 8 signal) | 2) gold on nickel finish | 3) ceramic BGA with eutec
