Electronics Forum: how to remove epoxy iphone chips (Page 1 of 3)

how to remove bubbles on silicone coating?

Electronics Forum | Mon Jul 04 20:10:05 EDT 2011 | rickysanchez

1.The bubbles appear only after the oven curing.before curing no bubbles encounterred. 2.The bubbles were very small, and can be found around the die in between the die and the epoxy. 3.Curing time is 150 degC for 4 hours.

BGA epoxy removal

Electronics Forum | Sun Feb 22 15:46:09 EST 2015 | slave2anubis

Hi, my name is Dacian, and i run a mobile phone repair shop in Timisoara, Romania. Lately we decided to do more advance motherboard repair jobs, and a big problem that we have is, cleaning the board after we remove the chips. We repair manly iPhone,

Re: Soldering to Gold

Electronics Forum | Fri Sep 17 06:01:12 EDT 1999 | Earl Moon

| | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a re

Re: Soldering to Gold

Electronics Forum | Fri Sep 17 09:54:40 EDT 1999 | Brian

| | | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a

Re: Soldering to Gold

Electronics Forum | Fri Sep 17 10:09:17 EDT 1999 | Earl Moon

| | | | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However,

Re: Too hot to handle

Electronics Forum | Tue Jan 26 19:30:36 EST 1999 | Nik

| | Greetings, | | | | Can anyone tell me what temperatures pcb's should have when coming out of a forced convection reflow oven and out of a wavesoldering machine. | | Also, is there any danger of the pcb's giving off some kind of gas or vapour whi

Re: Too hot to handle

Electronics Forum | Wed Jan 27 06:29:55 EST 1999 | Earl Moon

| | | Greetings, | | | | | | Can anyone tell me what temperatures pcb's should have when coming out of a forced convection reflow oven and out of a wavesoldering machine. | | | Also, is there any danger of the pcb's giving off some kind of gas or va

Re: Too hot to handle

Electronics Forum | Tue Jan 26 23:05:30 EST 1999 | Thomas Clift

| | | Greetings, | | | | | | Can anyone tell me what temperatures pcb's should have when coming out of a forced convection reflow oven and out of a wavesoldering machine. | | | Also, is there any danger of the pcb's giving off some kind of gas or va

Re: Too hot to handle

Electronics Forum | Thu Jan 28 10:09:51 EST 1999 | Charles Stringer

| | | | Greetings, | | | | | | | | Can anyone tell me what temperatures pcb's should have when coming out of a forced convection reflow oven and out of a wavesoldering machine. | | | | Also, is there any danger of the pcb's giving off some kind of g

Re: Too hot to handle

Electronics Forum | Mon Feb 01 15:23:26 EST 1999 | Nik

| | | | Greetings, | | | | | | | | Can anyone tell me what temperatures pcb's should have when coming out of a forced convection reflow oven and out of a wavesoldering machine. | | | | Also, is there any danger of the pcb's giving off some kind of g

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