Electronics Forum: how to skip component part (Page 2 of 7)

Re: How to do with tombstoning for component '0402'

Electronics Forum | Thu Nov 02 09:45:00 EST 2000 | bierleinb

I would check trace-pad interactions as you may be robbing heat from one of the pads causing uneven heating during reflow. Also, measure paste deposits on trouble parts to see volume depsoted across the pads. You should easily be able to do 0402s w

Re: How to do with tombstoning for component '0402'

Electronics Forum | Mon Nov 06 10:29:28 EST 2000 | Dean Stadem

All of the replies have merit. Here is another one. Because the cause of the tombstoning is wetting forces that are imbalanced, and one end wets faster or more readily than the other, the 0402 lifts up on that end easily because of its low mass. Incr

Best IP to get?

Electronics Forum | Thu Sep 28 09:19:05 EDT 2006 | realchunks

Apart from recommending a placement machine since I don�t know you product, part mix or tact time; I would just like to point out a few other things to consider when choosing a different placement machine. Feeders are a big thing. Mydatas are good

New to SMT Equipment

Electronics Forum | Thu Sep 18 17:11:57 EDT 2008 | realchunks

When looking at surface mount equipment you also have to remember your line pull process. Wil you issue reel of parts or just strips? Most of the bigger machine cannot take strips of parts. What about your set-up? Will you have a dedicated top an

New to SMT Equipment

Electronics Forum | Wed Sep 17 11:13:06 EDT 2008 | daxman

You had mentioned that your volumes will be low? How about the mix? will you be changing over to different products a lot? How many different products will you be running? Will feeder setups be done by the operators or will you have a another departm

How to choose a new solder paste

Electronics Forum | Thu May 26 08:52:42 EDT 2011 | davef

Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste � Not An Option Contributed by Phil Zarrow of ITM an Independent SMT consulting firm With soldering being the dominant source of assembly

How to import Part Data to Fuji CP65

Electronics Forum | Mon Feb 24 12:57:33 EST 2014 | mi

Import->Part->Library Import PD wizard Menu->Import->to Job->BOM (adds P/N only to assembly but does not go into Parts Library) etc. Among all these tools, they each prompt for different files with different name & extensions & format. I've trie

Re: Ic's sesitive to moisture

Electronics Forum | Thu Sep 23 10:11:15 EDT 1999 | Earl Moon

| Hi All, | | I'm recently receiving an IC in package for Ic's sensitive to moisture and not in another times, Somebody know how can I know if this Is moisture sensitive or not(which is the rule ?)?. the Ic is a soic14. | | | thanks | | I appreci

Cradle to Grave Part Tracking

Electronics Forum | Fri Feb 12 09:21:43 EST 2010 | petep

How are companies handling lot tracking of parts, down to the serial number of the PCBA on which each component is being placed? We have customers who are needing information on Mfg. Lot numbers on mission critical product in the event of Manufact

PCBA baking prior to rework

Electronics Forum | Mon Oct 14 18:27:38 EDT 2002 | kennyg

In regards to baking an assembly prior to hot air (BGA) rework.... 1) Do people always bake, sometimes or never? Does this depend on whether MS sensitive components are near the rework site? If a BGA is to be removed and reballed, baking is a no-br


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