Electronics Forum | Mon Aug 27 08:08:20 EDT 2012 | rgduval
An ICT solution seems to be overkill for what you've described. What kind of volumes are you hand building? How many components are not marked? What is your current yield with the process you are using? What is/was your yield prior to implementing m
Electronics Forum | Tue Oct 15 10:12:44 EDT 2002 | davef
1) Do people always bake, sometimes or never? Does this depend on whether MS sensitive components are near the rework site? If a BGA is to be removed and reballed, baking is a no-brainer. Sometimes, based on the proximity of the MS components. >2)
Electronics Forum | Mon Apr 21 12:46:48 EDT 2003 | jonfox
It sounds as if the boards are designed in-house. Is this correct? If so, look for SMT versions of the BNC connector. I hhave used one from Johnson Components (http://www.johnsoncomponents.com) or look through http://coaxicom.com for something yo
Electronics Forum | Tue May 21 17:16:51 EDT 2002 | davef
Larry, Yes, no matter how much you�d like to avoid using NC, you probably will have to start using the stuff, if the design [sales, in your case] types have their way. We can clean WS under 1mm and 1.25mm pitch BGA. For 0.8mm pitch BGA, we use NC.
Electronics Forum | Tue Jun 26 19:59:08 EDT 2001 | davef
They always tell you to calculate ROI, when they want to blow you off. Do a net search using - calculate ROI. Links to three pretty good descriptions on this are: http://www.dmreview.com/editorial/dmreview/print_action.cfm?EdID=2487 http://www.eval
Electronics Forum | Mon Feb 01 15:23:26 EST 1999 | Nik
| | | | Greetings, | | | | | | | | Can anyone tell me what temperatures pcb's should have when coming out of a forced convection reflow oven and out of a wavesoldering machine. | | | | Also, is there any danger of the pcb's giving off some kind of g
Electronics Forum | Fri Apr 20 13:04:51 EDT 2018 | dleeper
Have you tried using a larger nozzle? If the selected nozzle is too small, it won't provide enough force to hold the part in place. What kind of part are you having trouble with?
Electronics Forum | Mon Apr 04 09:35:16 EDT 2005 | russ
What are the max temp specs for each of the components? this sounds like the real problem with lead free conversion. Which parts are which? Currently we are getting ready to reball lead free BGAs back to lead for a customer that had to be lead free
Electronics Forum | Mon Feb 22 12:20:51 EST 1999 | Dave F
| Does anybody have any reliable alternatives to device bake out for plastic bodied components. We do not use a whole package at time and therefore have to oven bake the balance before we can use them. | I have come accross dry nitrogen storage cham
Electronics Forum | Tue May 24 15:39:04 EDT 2016 | spoiltforchoice
It seems a remarkable coup to have been awarded a grant without already having specified exactly why you want it, what you are going to spend it on and how it will benefit your business and the local area. I had an email about the Fox just the other
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