Electronics Forum | Mon Apr 08 00:08:00 EDT 2019 | jamestong
With the increase of labor costs, the popularity of automated production lines, IC tubes, connector tubes, power module tubes, LED tubes, relay tubes and other electronic components tubes are also becoming more widely used. Many small companies blind
Electronics Forum | Tue Oct 26 00:03:09 EDT 2010 | jmelson
Hmm, that's a fairly old machine, even older than mine! (I have a CSM84 PA130640). Anyway, it is best to program the machine from CAD system data, I wrote a little program in C to read in the component type and XYR position, and produce the file in
Electronics Forum | Mon May 08 20:52:18 EDT 2000 | Dave F
Steve: A couple years ago, I decided that I needed to broaden my education in the areas(s) that I make my livelihood � soldering and assembly. I had attended some excellent (and some not so excellent) tutorials at NECON, but just felt I was missing
Electronics Forum | Thu Jul 30 03:34:52 EDT 2009 | babe7362000
The parts are from 2000-2004. The temperature at the leads are between 215-220. When the part is removed from the board, some of the leads are nice and shiny and some have dewetting, so I dont think it is a temperature issue.
Electronics Forum | Wed Jul 29 12:48:25 EDT 2009 | mikesewell
Kester R562 is listed as an ORH0, a high activity flux, not sure switching pastes would gain much. What is the finish on the leads? How old are the parts? You could have the parts reconditioned (SixSigma, Corfin, ...others) but this can get costly
Electronics Forum | Tue May 18 15:25:14 EDT 2010 | dwonch
We do a lot of intrusive reflow. It works very well but the others are correct you need to verify that the part can survive the high temps. Most TH components are not rated for reflow, we have to test each one ourselves.
Electronics Forum | Wed Jul 29 10:46:04 EDT 2009 | babe7362000
I was wondering if anyone knows the best way to clean oxides off of fine pitch components? Apparently the paste we use does not have strong enough flux to remove the oxides off of the leads of the components. I have validated the profile and that i
Electronics Forum | Thu Jun 16 03:25:19 EDT 2022 | leaderway0
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Electronics Forum | Fri Nov 25 00:07:23 EST 2005 | pyramus
Nope actually the whole bluetooth component is a raw part comprising of BGA and chip components in one small PCB wherein this whole assembly is encased in a shield. So basically when we recieve the part we can only see the shield and some minor chi
Electronics Forum | Tue Sep 19 20:23:09 EDT 2000 | Arturo
99.70% mounting rates. 4.Make sure your machine can handle the recognition of this components (shape & height) usually height measuring(pick up error) is the biggest problem with resistors. 5.When mounting a real PCB you can have spacings up to 0.3mm
