Electronics Forum: how to solvce tombstone in smt (Page 1 of 2)

How to calcualte the capa. of smt line in high mix low volume.

Electronics Forum | Tue Sep 11 20:42:16 EDT 2001 | davef

Some folk at Cookson in Rhode Island [US] developed software to answer questions like you appear to be asking. Cookson licensed it to some meatheads in New Jersey that made a total mess of the whole thing. Then, Phil Zarro in New Hampshire got it

How to calcualte the capa. of smt line in high mix low volume.

Electronics Forum | Mon Sep 17 03:19:01 EDT 2001 | mugen

Interesting, we have a SMT division, that caters to the exact scenario you depict... Actually am also trying to determine, a system of answering "high mix, low volume" picture... Just my humble point of view, dun think there is "best" system in th

How to calcualte the capa. of smt line in high mix low volume.

Electronics Forum | Tue Sep 11 19:54:52 EDT 2001 | gsparka

HELLO. SMTNETERS there is no company in high mix low volume system in our contry so . what is the best way to calculate the capa. of smt line in high mix low volume. & what is the general way to get the defect rate to evaluate the smt line(or sm

How to avoid tombstoning in 0201 components

Electronics Forum | Fri Jul 22 07:21:14 EDT 2005 | Mark

Try using Cobar`s anti-tombstone alloy.

How to avoid tombstoning in 0201 components

Electronics Forum | Tue Jul 05 15:21:46 EDT 2005 | russ

So your thermal cycling test is putting these solder joints into reflow (183C + if they are lead joints)? Must be quite the test! Tell us what pad sizing and spacing you are currently using.

How to avoid tombstoning in 0201 components

Electronics Forum | Tue Jul 05 13:54:35 EDT 2005 | Sandeep

We are facing lot of problems with tombstoning in 0201 components. Ironically tomstoning in these components is not occuring while reflow but it is happening when we subject them to thermal cycling test. We have been investigating the cause and thoug

How to avoid tombstoning in 0201 components

Electronics Forum | Fri Jul 29 19:12:30 EDT 2005 | Jason Fullerton

In the true sense of the term, tombstoning can only occur during reflow. Now, if your solder joints are cracking during thermal cycling and opening on one end you still have a problem - it just isn't "tombstoning". What laminate are you using on yo

When to implement SPI in your SMT line

Electronics Forum | Thu Apr 01 17:35:16 EDT 2021 | cyber_wolf

Building on what Evtimov said, folks who are not familiar with SPI get freaked out when they first deploy it. You need to have an understanding of whats going on and how to adjust when you get "failures" I would advise that anyone who is g

SAC305 preforms not wetting to ENIG pad in fluxless process

Electronics Forum | Wed Apr 28 15:51:52 EDT 2021 | duchoang

Could you share some pictures? Without any flux or paste, how could you place preforms on pads? SMT Pick and Place ?

Just wondering have anyone tried to build two/three same boards in parallel of one SMT line...

Electronics Forum | Wed Dec 09 07:14:16 EST 2020 | bukas

if you can set bad mark white=good on first machine, black=good on second machine and place same 3 components on them then all is left for 3rd machine not to look for bad mark but just to place remaining components. is board panelized? do some math a

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