Electronics Forum: hp amp chassis assembly (Page 1 of 5)

Re: testing after SMt assembly

Electronics Forum | Wed Jul 21 10:11:57 EDT 1999 | Mark Quealy

| | Dear all | | Please help me to know what kind of tests usually done after SMT Pick & place and reflow oven. | | Our appliocation is Mainly fabrication of mother boards. | | Thanks | | | In theory, ICT is the classical answer (In-Circuit Test).

Re: testing after SMt assembly

Electronics Forum | Fri Jul 23 10:16:16 EDT 1999 | Boca

| | | Dear all | | | Please help me to know what kind of tests usually done after SMT Pick & place and reflow oven. | | | Our appliocation is Mainly fabrication of mother boards. | | | Thanks | | | | | In theory, ICT is the classical answer (In-Ci

CM in Brazil

Electronics Forum | Thu Aug 24 09:10:57 EDT 2000 | Steve Schrader

Can anyone recommend a good turnkey Contract Manufacturer in Brazil for low volumes of moderate complexity board and chassis assembly? Please send comments via email to steves@smtnet.com, thanks.

Re: CM in Brazil

Electronics Forum | Mon Sep 04 17:47:07 EDT 2000 | SERDIA ELETRONICA INDUSTRIAL

We are an ECM located in southern Brazil specialized in low and medium volumes and high mix. We also do chassi assembly. You can reach us through the address above or phone 55 41 3334655 Our site www.serdia.com.br is only in portuguese at the moment

BGA cracking

Electronics Forum | Mon Sep 15 06:14:49 EDT 2008 | milas

Hi Has anyone experienced laminateand BGA cracking on ENIG finish boards built using a lead free process? The laminate is cracked directly underneath the pad where the solder joint has cracked. We have confirmed the cracking via Microsectioning. We

QSTATS at HP3070 Series 3

Electronics Forum | Tue Sep 08 20:32:55 EDT 2009 | juanv

Hi, This is the firstime that I'm working with a HP 3070 Series 3 ICT. We ran the first assemblies and I would like to know where could I find all the information about this first article run. Fist of all, I need to know how could I visualize at

GSM2

Electronics Forum | Wed Jan 20 16:26:34 EST 2021 | ttheis

Low Air Pressure: System reporting low air pressure; verified 12Vdc at pneumatic panel, manually jumpered and verified connections back to GPIO1 connector on the LOC I/O assembly. Swapped LOC IO cards then entire LOC IO chassis, with another machine.

Universal Lightning Head Spindles

Electronics Forum | Sat Aug 18 22:43:14 EDT 2012 | eadthem

we service all of our lightning spindles once a year, Take the spinldes off. loosen the screw by the nylon cap and slide the locking pin out. run the spindle shaft, the nylon cap and pin assembly , and spring thrue a ultrasonic cleaner with 99% is

5DX

Electronics Forum | Mon Jul 18 16:58:31 EDT 2005 | Gpe. E

Hi everybody. I would like to know if any of you guys is using the HP5DX output processor from Assembly Expert to generate de .NDF files for the 5DX machines. I tried but I got a lot of errors because de configuration file for that processor needs

Re: BGA solder joints versus mechanical stresses

Electronics Forum | Thu Sep 02 16:52:31 EDT 1999 | Earl Moon

| | | Has anyone done or seen any studies done documenting what may be the affect of hardware such as screws in the parimeter vicinity of BGAs on a circuit board? | | | | | | What I'm really after is anything describing how close a screw/washer/nut

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