Electronics Forum | Tue Apr 05 15:32:49 EDT 2011 | grahamcooper22
It is one of our pastes...Almit LFM48 W TM-HP, a high reliability no clean solder paste based on SAC305 with a size 4 powder. It's a paste that works so well we have thousands of users of it worldwide. Why are you using SN100C alloy paste ? I imagin
Electronics Forum | Tue Jul 03 02:42:37 EDT 2012 | kq702
Hi I did a reflow on an HP laptop a while back- it was a DV6000 series. The original problem was the internet stopped working- turns out the south bridge chipset was causing the issue (its a very common issue I found out after searching online). Some
Electronics Forum | Sun May 17 00:41:17 EDT 2009 | microdot
hi, I am sorry if i sound offended anybody. What i meant is that we are handling boards which are from major manufacturers like hp / compaq / dell / ibm / intel. So if annybody has experience of handling it..than they may have reflow profiles of sa
Electronics Forum | Sun May 30 15:11:10 EDT 1999 | M Cox
| | | | | Is it possible to place parts that do not have leadframes exposed when looking from the top side of the part such as BGA's using a Fuji IP1 with a SMD1 vision (Binary) system. I realize that the IP1 does not have front lighting but accordin
Electronics Forum | Sun May 30 18:34:04 EDT 1999 | Earl Moon
| | | | | | Is it possible to place parts that do not have leadframes exposed when looking from the top side of the part such as BGA's using a Fuji IP1 with a SMD1 vision (Binary) system. I realize that the IP1 does not have front lighting but accord
Electronics Forum | Sun May 30 12:33:36 EDT 1999 | Earl Moon
| | | | Is it possible to place parts that do not have leadframes exposed when looking from the top side of the part such as BGA's using a Fuji IP1 with a SMD1 vision (Binary) system. I realize that the IP1 does not have front lighting but according
Electronics Forum | Wed Jan 19 00:42:09 EST 2000 | park kyung sam
In my case, when i solderd the bga in normal reflow(convection hot air). There is a lot of boid. i had tried to reduce void long time. so i reduced just a little. It did't satisfied me but now i cannot looking for the void in soldered bga i
Electronics Forum | Fri Dec 03 19:44:34 EST 1999 | Russ
Hello all, I am in the process of converting our facility to noclean processes. So far I am experiencing troubles with soldering to gold finishes. The finish is an H.P. type1. The solder joints appear dull and grainy. They seem to be very strong
Electronics Forum | Wed Apr 08 07:16:21 EDT 2009 | arrowvale
We have just switched to Almit (www.almit.com)LFM48 W TM-HP-S lead free solder paste. In general terms it is an easy printing paste, with great slump properties, wide reflow process window and offers excellent solderability on all pcb / component pa
Electronics Forum | Thu Jul 15 11:01:06 EDT 1999 | Earl Moon
| | Hello All, | | I am setting up a line to mount CSP/uBGA devices and now am looking at the X-Ray process. It is my opinion that this should be done offline - can you tell me if Im right or do I need to put one inline? | | Also anyone who is mou
