Electronics Forum: hp3070 fixture motherboard (Page 1 of 1)

In search of��

Electronics Forum | Wed Aug 25 15:13:57 EDT 1999 | MCox

A Test Fixture House, I need test and fixture development, along with someone who can service my existing test fixtures/programs I am running a HP3070 W Double density test cards� If anybody has some TESTimonials, that would be wonderful Thanks M

AOI vs. electrical test

Electronics Forum | Tue Jan 03 15:16:53 EST 2006 | Cmiller

In circuit testing is expensive up front because of the fixture cost but the tests are fast. AOI programs can be develpoed in less than a day but take longer to run. If you have good test coverage, in circuit would be a better choice in my opinion-if

Re: testing after SMt assembly

Electronics Forum | Wed Jul 21 10:11:57 EDT 1999 | Mark Quealy

| | Dear all | | Please help me to know what kind of tests usually done after SMT Pick & place and reflow oven. | | Our appliocation is Mainly fabrication of mother boards. | | Thanks | | | In theory, ICT is the classical answer (In-Circuit Test).

Re: testing after SMt assembly

Electronics Forum | Fri Jul 23 10:16:16 EDT 1999 | Boca

| | | Dear all | | | Please help me to know what kind of tests usually done after SMT Pick & place and reflow oven. | | | Our appliocation is Mainly fabrication of mother boards. | | | Thanks | | | | | In theory, ICT is the classical answer (In-Ci

ICT information needed

Electronics Forum | Tue Feb 22 07:59:54 EST 2000 | Hany A. Salam

Hello friends: In a few weeks we will have to assemble PC motherboards. We decided to use to purchase an ICT for testing the semi assembled boards (I mean with only SMD components on). Would anyone kindly like to recommend a SPECIFIC brand or model

ICT information needed

Electronics Forum | Tue Feb 22 07:59:54 EST 2000 | Hany A. Salam

Hello friends: In a few weeks we will have to assemble PC motherboards. We decided to use to purchase an ICT for testing the semi assembled boards (I mean with only SMD components on). Would anyone kindly like to recommend a SPECIFIC brand or model

solder joint crack in post thermal cycling test at Dye & Pry

Electronics Forum | Sun Apr 11 11:39:52 EDT 2010 | manchella

When we have sent some of motherboards for reliability testing in a tird party laoratory. It is found that when Dye&Pry is done after 600 cycles of Thermal Cycling, in LGA socket only one of the corner solder joing had 100% type 3 crack. All other so

*****Update: Depanelization Troubles; Please Read*********

Electronics Forum | Thu Jun 18 15:04:48 EDT 1998 | smd

| | | We're running into problems with board damage (broken traces, solder shorts) due to pliers and other bizarre tools being used for depanelization. I need some sort of fixture for this. A delrin plate with a slot cut to the correct depth and wid

Re: *****Update: Depanelization Troubles; Please Read*********

Electronics Forum | Thu Jun 18 22:25:24 EDT 1998 | Dave F

| | | | | We're running into problems with board damage (broken traces, solder shorts) due to pliers and other bizarre tools being used for depanelization. I need some sort of fixture for this. A delrin plate with a slot cut to the correct depth and

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