Electronics Forum | Wed Feb 24 14:17:20 EST 2016 | rgduval
I have a customer who is rather inexperienced, and asking us for a solution for them. They have a circuit board that's roughly two inches long by 1/2" wide or so, with component placements on one end of the board. The other end has a trace that I s
Electronics Forum | Thu Jun 17 16:18:22 EDT 1999 | Earl Moon
| | Has anyone had problems with the Weller MT 1500 IRON/TIP solder station? | | Please advise your problem and resolution. | | | | ddj | | 6/16/99 | | | I don't like to use the needle tips (MT2 series), but the rest of the tips work fine. The MT2
Electronics Forum | Tue May 14 14:48:33 EDT 2002 | fmonette
Hi Dason, Here is some relevant information that you might find useful : J-STD-033, section 7.1.2.2 Dry Box : "Components may be placed in a dry box, capable of maintaining 25+/-5C and less than 10%RH. Nitrogen or dry air may be used." In other w
Electronics Forum | Fri Aug 12 22:10:24 EDT 2005 | Mika
I agree with all the prior postings! But I have some additional thoughts about this. If there is a build up of moistures (% humidity) inside the pcb; before you reflow the pcba; then you will have the result out of the oven, just as you described. My
Electronics Forum | Mon Aug 21 19:38:33 EDT 2000 | Dave F
Eric: I�ll pass on the uV and ammonia, also. Thoughts are: 1 You�re correct that the temperature/humidity mix can be a big driver to latex peelable solder mask cure time, but don�t overlook material thickness. Dispensers put material in a very th
Electronics Forum | Mon Feb 22 12:20:51 EST 1999 | Dave F
| Does anybody have any reliable alternatives to device bake out for plastic bodied components. We do not use a whole package at time and therefore have to oven bake the balance before we can use them. | I have come accross dry nitrogen storage cham
Electronics Forum | Tue Dec 17 20:25:13 EST 2002 | iman
Check : 1) design aspect ratio / are ratio required to fabricate the stencil you r using. 2) check if the stencil maker is using your checked aspect ratio / area ratio? if not the same, what are they using? any QA report confirming actual dimension
Electronics Forum | Sat Aug 03 07:29:20 EDT 2002 | davef
IPC-PE-740 "Troubleshooting for Printed Board Manufacture and Assembly" has words to the effect of � 1.5---BAKING Laminate materials are baked several times during the manufacture of a printed wiring board. There are four major reasons for
Electronics Forum | Wed Dec 20 23:29:32 EST 2006 | Jack
Hi all, Is there anyone know the correct way to obtain the accurate temperature profiling for oven reflow? Are below claims true? (1) Instead of full components on the PCBA (Motherboard), the profile taken from PCBA with few components can be cons
Electronics Forum | Sat Jul 21 08:45:10 EDT 2001 | davef
In the past, we have spoken [typed?] about controlling the temperature and humidity of our plants. And it's probably good to do that from solder process control, ESD danger reduction, and human factors stand-points. We are looking to lower our ener
.png)
