Electronics Forum | Tue Jan 23 09:03:00 EST 2001 | fmonette
This guideline is actually in the IPC/JEDEC standard J-STD-033, May 1999 (although it is not spelled out very clearly, thus the current confusion in the industry). The technical reason is that moisture diffusion is a very slow process. Once parts ha
Electronics Forum | Fri Jul 30 17:22:48 EDT 1999 | Dave F
| | Surface Mount Components like QFP's in Tray usually comes sealed in an anti-static plastic pack. In case the QFP's were removed from the said anti-static bag for more than 2 weeks, do these components needed to be baked for they might produce so
Electronics Forum | Tue Apr 16 13:59:33 EDT 2002 | paulausten
They work great as long as your conveyor speed > has been calibrated and checked on some type of > PM schedule. On some oven types these sensors can > warn you to possible problems with the conveyor > speed. Say the oven is calculating that the b
Electronics Forum | Tue Oct 06 15:41:14 EDT 1998 | Mike C
| | Does sombbody know what DPM rate a good and reliable SMT assembly line (incl. solder paste print, assembly and feflow soldering) has? | | DPM is Defects per million, usually measured on components. We run a process consisting of small to medium b
Electronics Forum | Wed May 09 03:29:16 EDT 2001 | Eyal Duzy
Yes, your observation is accurate. Different process steps have different inspection requirements which necessitates employing different imaging technology to ensure the best performance (detection and throughput). Orbotech, for example, offers both
Electronics Forum | Wed Jan 27 23:29:28 EST 1999 | parag palshikar
| | i am working with the noclean process and getting white residues on the bottomside of the board probably due to the | | wave soldering flux.i am using a no-clean solder paste and a noclean wave solder flux.The boards passed the accelerated tempe
Electronics Forum | Thu Nov 13 17:18:11 EST 2003 | davef
First, don�t get distracted by �OA� and �NC� formulations. This is nomenclature. We want to discuss the issue of �activity�. J-STD-004 "Requirements for Soldering Fluxes" classifies fluxes by their chemical composition, activity level and halide c
Electronics Forum | Fri Dec 17 16:25:05 EST 1999 | Brian W.
I used an off-line paste height measurement device to control my paste process. I did not inspect every board, just a random sample once an hour. I have used both manual and automatic devices. I like the automatic becuase: 1 - I have no "operat
Electronics Forum | Thu Oct 01 16:46:50 EDT 1998 | Dave F
We are trying to eliminate/minimize the baking process for high lead-count ICs. We would like to reseal packages containing these parts to minimize exposure to humidity. Anyone have or know of a way to reseal or vacuum pack parts? Any suggested eq
Electronics Forum | Wed Nov 19 13:16:54 EST 2008 | sjpence
Simon, The equivalence factors were used to scale the values measured by ionic testing equipment to the values measured in the standard manual method. There is a good write-up by Bill Kenyon in this Technet Post describing the creating of the facto
