Electronics Forum: humidity indicator type 2 (Page 9 of 12)

Re: Parylene Coating of Plastic Parts

Electronics Forum | Fri Aug 06 07:18:48 EDT 1999 | Graham Naisbitt

| | | | | Has anyone out there tried to parylene coat plastic parts prior to soldering them to a pcb? I'm looking at several potential applications where fewer than 5% of my components on a pcb are plastic, yet from a reliability aspect (environmenta

Re: Drying ICs any advice

Electronics Forum | Sun May 17 13:46:30 EDT 1998 | Steve Gregory

Hi All! I've been reading this conversation which prompted me to break out the IPC-SM-786A from the IPC manuals from our parent company in Maryland sent us (we're just starting up in California). It's the Procedures for Characterizing and Handling of

Tombstone

Electronics Forum | Tue Aug 28 13:08:28 EDT 2001 | seand

Hello Everyone, Mountains and mountains of data in the archives. As a contractor the variables in your production lots don't help I'm sure. On a larger scale, one suggestion maybe to first look at when and where your tomb stoning is occuring. 1

Re: Altera PQFP240 Solderability

Electronics Forum | Thu Apr 16 13:50:49 EDT 1998 | Lou

| We are having some difficulty soldering a 240 pin Altera device. We use Alpha WS-609, a very generic profile for that solder paste, and a 6 mil stencil with laser cut apertures (1:1 ratio). This is a 20 mil pitch device (aperture size is 10 mils X

Re: Altera PQFP240 Solderability

Electronics Forum | Thu Apr 16 13:47:36 EDT 1998 | Lou

| We are having some difficulty soldering a 240 pin Altera device. We use Alpha WS-609, a very generic profile for that solder paste, and a 6 mil stencil with laser cut apertures (1:1 ratio). This is a 20 mil pitch device (aperture size is 10 mils X

Info on OSP PCB�s

Electronics Forum | Tue Jun 05 21:14:10 EDT 2001 | davef

You aren't going to post our stuff on your "Hey, I'm the wizard site", are you? Board fab, Pad coatings, OSP 1 OSPs: Imidazole (Via Systems) is good. Entek (Enthone) works, but requires strict thickness control in fab. 2 Enthone CU56 allows one t

Re: Wetting Balance Equipment

Electronics Forum | Mon Aug 17 02:57:47 EDT 1998 | Bob Willis

| | Looking for Suppliers of surface mount wetting balance equipment. | Bucky: Section 6 of the ANSI/J-STD-002 specification lists wetting balance suppliers. Dave F I like and continue to use the Multicore system. I have had many ours using the sys

Re: Ghost circuit shorts under smt resisters only when they are located on solder side of pcb (glued down)

Electronics Forum | Mon Jul 26 14:14:51 EDT 1999 | Steve Gregory

| | | We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. | | | The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is th

Why is NC the prefer process for BGA mounting? why not WS?

Electronics Forum | Tue Aug 21 21:39:19 EDT 2001 | davef

1) why is No-clean (NC) the preferred process, for BGA mounting by SMT? Probably the same reason NC is the preferred process for mounting non-area array SMT components. 2) why is water-soluble (WS) not a hot choice? There�s not reason not to use

Re: Problems with wave solder

Electronics Forum | Wed Nov 18 21:58:17 EST 1998 | Dave F

| | | For some as yet unkown reason, we have started to have some boards sag and go under the wave. The boards are surface mount top side and conventional components wave soldered. We have checked the wave hight and both the profiles on the wave sold


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