Electronics Forum | Fri Nov 20 09:07:43 EST 2009 | Sean
Hi all, Another thing that I would like to discuss here is that I used to come across few reports that mention about the flux residue has great impact on the PCBA impedance, especially when everything become smaller and smaller...I mean, when mother
Electronics Forum | Tue Jun 10 11:07:33 EDT 2003 | fmonette
Another important element to consider is the impact of ambient temperature and humidity on Moisture Sensitive Components. The majority of plastic encapsulated ICs are classified as moisture-sensitive devices (MSD). This means that they are qualifie
Electronics Forum | Tue Aug 22 11:03:45 EDT 2000 | Dr. Ning-Cheng Lee
Hi Kelvin, Regarding to the surface finish of the leads, Sn or Pd may be the direction that the industry takes. First of all, the answer must be "Pb-Free", limiting our choices. Sn has good solderability, and it won't have too great of an impact o
Electronics Forum | Mon Apr 16 09:12:23 EDT 2007 | davef
Standard for appearance: J-STD-001 and IPC-A-610 committees eliminated the requirement that solder connections be "bright and shiny". Certain solderability protections; such as Au, NiPd, NiPdAu; can affect the surface texture of a solder connection,
Electronics Forum | Mon Jun 28 02:10:10 EDT 2010 | tpvnew
Thank you very much for your reply. I do have the numbers for placement per hour, but, I have some concerns on it (forgive me if it is a stupid concern, as I said, I am new in this field, and trying to figure out this business). For example, it is
Electronics Forum | Wed Apr 24 21:35:34 EDT 2002 | davef
Ooooo, much better. Tough to say, because of all the variables [ie, different materials, moisture level, temperature, etc]. Plastic encapsulated devices, especially IC, absorb water from the air, which is violently released during soldering. Typica
Electronics Forum | Thu Aug 17 07:53:31 EDT 2000 | Wolfgang Busko
Getting things "foolproof" is sometimes a hard effort and can cost a lot of money. Who is able to tell that it actually saves money instead of wasting it. Transfering responsibility from operators to a system may lead to a somewhat less responsible a
Electronics Forum | Fri Apr 30 13:26:10 EDT 2021 | amaliahx
The pandemic has altered people's habits, causing a surge in demand for home electronic devices. This has swept the global chip supply and disrupted automobile manufacturing. The pandemic has led to the global shortage of semiconductors or chips, and
Electronics Forum | Mon May 14 17:12:20 EDT 2001 | davef
Continuing along the path that Brian took ... IPC-7525 gives design guideline for stepped stencils. It goes something like: * Stepped area SB GT 25 thou from pads located on the greatest thickness of the stencil * Pads in stepped area SB GT 35 tho
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
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