Electronics Forum | Mon Jun 21 15:00:41 EDT 1999 | jgodfrey
I am finding that some of our IC's are coming from the supplier with the humidity gauge in the bag reading 10-20%. Has anybody done any tests to determine what humidty level in a package will cause problems during reflow?
Electronics Forum | Tue Sep 10 05:39:04 EDT 2019 | richgreen01
Hi all. I have put.an ic on the y wagon and done first.and last component. The machime picked up the part while testing the package but it didnt center the part ,just sat there for a while and failed. Any idea why this is and am I missing something?
Electronics Forum | Mon Jun 21 16:11:41 EDT 1999 | John Thorup
| | I am finding that some of our IC's are coming from the supplier with the humidity gauge in the bag reading 10-20%. Has anybody done any tests to determine what humidty level in a package will cause problems during reflow? | Usually a proper m
Electronics Forum | Mon Jun 21 15:11:38 EDT 1999 | JohnW
| | I am finding that some of our IC's are coming from the supplier with the humidity gauge in the bag reading 10-20%. Has anybody done any tests to determine what humidty level in a package will cause problems during reflow? | | Sound's to me li
Electronics Forum | Tue Aug 26 21:20:58 EDT 2003 | iman
You may check with the TDS of respective "active parts" IC manufacturers for their recommended no. of thermal cycles permissible in the reflow process. Last I checked 3 cycles for our RF-apps IC was still allowed. For 48pin-QFPs this can be allowed
Electronics Forum | Tue Aug 22 09:30:31 EDT 2000 | Kelvin Chow
Mr. Lee, Although most of the lead free alloy used for solder paste and wave soldering have been identified, a suitable alloy used for leaded Ic packages (like QFP, PLCC..etc) have not been identified yet. Do you have any suggestion on this lead-f
Electronics Forum | Thu Sep 23 09:59:56 EDT 1999 | Al Carrillo
Hi All, I'm recently receiving an IC in package for Ic's sensitive to moisture and not in another times, Somebody know how can I know if this Is moisture sensitive or not(which is the rule ?)?. the Ic is a soic14. thanks I appreciate your help.
Electronics Forum | Fri May 15 04:06:33 EDT 1998 | Alan Pestell
We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin packages. How d
Electronics Forum | Thu Jun 02 14:23:36 EDT 2022 | SMTA-64387182
We are designing a new PCB that will include a 0.4 mm WLCSP IC package. The OEM’s application-note for this package states ENIG; Au
Electronics Forum | Tue Aug 22 11:09:15 EDT 2000 | Eugene Smelik
Dr. Lee, Following up on this thread, I have read that a Pd-Ni lead finish is one promising option, but that Ni-oxidation might be problem. Can you explain this more? Thanks, Gene Smelik Cookson Performance Solutions
