Electronics Forum | Fri May 19 08:05:23 EDT 2000 | David
We do a lot of prototype work, builds occur days or months apart and moisture Absorption in IC's is a worry. I would like to bake, chuck in some silica gel and then seal or vac seal in an envelope. Does anyone have any experience of vacuum sealing wa
Electronics Forum | Sat Feb 28 14:00:18 EST 1998 | Gary Simbulan
I have run across reference to EIA-481 for specifications on Tape And Reel components for automatic placement and am looking for something similar that specifies standards or dimensions for IC Tubes or sticks. I am trying to make the vibatory feeder
Electronics Forum | Thu Mar 19 17:02:50 EST 1998 | TaeDong Park
| I have run across reference to EIA-481 for specifications on Tape And Reel components for automatic placement and am looking for something similar that specifies standards or dimensions for IC Tubes or sticks. I am trying to make the vibatory feed
Electronics Forum | Tue Sep 10 05:39:04 EDT 2019 | richgreen01
Hi all. I have put.an ic on the y wagon and done first.and last component. The machime picked up the part while testing the package but it didnt center the part ,just sat there for a while and failed. Any idea why this is and am I missing something?
Electronics Forum | Tue Aug 22 09:30:31 EDT 2000 | Kelvin Chow
Mr. Lee, Although most of the lead free alloy used for solder paste and wave soldering have been identified, a suitable alloy used for leaded Ic packages (like QFP, PLCC..etc) have not been identified yet. Do you have any suggestion on this lead-f
Electronics Forum | Thu Sep 23 09:59:56 EDT 1999 | Al Carrillo
Hi All, I'm recently receiving an IC in package for Ic's sensitive to moisture and not in another times, Somebody know how can I know if this Is moisture sensitive or not(which is the rule ?)?. the Ic is a soic14. thanks I appreciate your help.
Electronics Forum | Fri May 15 04:06:33 EDT 1998 | Alan Pestell
We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin packages. How d
Electronics Forum | Thu Jun 02 14:23:36 EDT 2022 | SMTA-64387182
We are designing a new PCB that will include a 0.4 mm WLCSP IC package. The OEM’s application-note for this package states ENIG; Au
Electronics Forum | Tue Aug 22 11:09:15 EDT 2000 | Eugene Smelik
Dr. Lee, Following up on this thread, I have read that a Pd-Ni lead finish is one promising option, but that Ni-oxidation might be problem. Can you explain this more? Thanks, Gene Smelik Cookson Performance Solutions
Electronics Forum | Mon Oct 25 14:40:13 EDT 2010 | rgduval
It's pretty much true, every company builds their own package database...usually on an as you go basis, meaning you create packages as you need them. If you bought the machine from MyData, it should have shipped with at least the basic packages in p
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