Electronics Forum | Tue Feb 15 09:27:34 EST 2000 | Casey Scheu
Sal, This is a common problem experienced by several OEM's. It all comes down to heat. This is why the problem is corrected on your repair unit. I would suggest using a Slim Kic or Data Pac (mole) to thermal couple the IC prior to the reflow oven.
Electronics Forum | Tue Dec 18 18:36:58 EST 2001 | guicho_v
Is the Sn% of the plating of the pin related to wetting quality?. I am having issues with one IC maker where some pins are OK and one or two pins are not soldered, even when there is weeting evidence underneath the pin. I am blaming the %Sn too hig
Electronics Forum | Fri Aug 19 06:49:27 EDT 2011 | leadthree
I got this MQFP-144 and the soldering looks always very flimsy. I think I use a suitable leaded paste (water-soluble) and the stencil thickness is also OK. The IC on the image looks a bit shifted, that's not the problem. The problem is rather that
Electronics Forum | Wed Dec 19 09:56:20 EST 2001 | guicho_v
I'm new in SMT world, and I've got my 1st challenge: I'm having de-wetting issues with a specific IC 160 pins MQFP (six location, failure is random), where one pin has de-wetting (solder reflow OK, and there is evidence of having contact the past and
Electronics Forum | Tue May 28 21:00:59 EDT 2002 | davef
That is the rub here, isn�t it? For those posting, it�s easier [but much slower] to start a new thread than to search the archives. [And posters could view their issue so unique and novel that it could never have been discussed several years earlie
Electronics Forum | Fri Feb 19 09:14:52 EST 1999 | Justin Medernach
| During inspection and test we find leads which do not get soldered. Some are because of insufficient paste, but with others everything looks right. This will only happen on 1 to 2 pins, and it is not isolated to a specific type of ic or location o
Electronics Forum | Thu Nov 04 19:55:49 EDT 2010 | eadthem
The best method i have for the few lifted/bent lead issues we have is i use a ic/bridge inspector with all its default options to check for bridges and solder at the tip. then i add a solder inspector but this time accrost all pins at the downslope o
Electronics Forum | Fri Jun 09 05:18:07 EDT 2006 | Rob
Hi Shawn, that you're baking the components makes me think that they are either old, or have been sitting around for a while (or none of the above & you are really dilligent!) Whilst baking will sort out the MSD issues (such as popcorning) it will
Electronics Forum | Wed May 27 14:35:52 EDT 1998 | Justin Medernach
| | R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recomm
Electronics Forum | Thu Jul 17 17:36:28 EDT 2014 | proy
Hi, > > If you can not rely on your programmer and > the tools he uses then "double checking" can save > you only materials but in time you really do not > save often extend meaning. There are things you > can identify before the stove, but if
